LaserJob
Founded in 1992, LaserJob specializes in laser-cut stencils for printed circuit boards used in electronic devices.
Since 1992 LaserJob GmbH has been producing high grade SMD stencils and delivers the stencils to electronic companies worldwide. In 2011 LaserJob started a production facility in Toronto, Canada, to be able to provide rapid and direct service in the strategic markets of America.
LaserJob specializes in laser-cut stencils for printed circuit boards used in electronic devices, notably smartphones. (Among its major North American customers is Blackberry device maker Research In Motion.) The firm has gradually expanded from processing SMD stencils to other areas, from automotive (e.g. 1 mm copper) to laser welding and laser marking. In 2010 the company moved into "electro-erosion," which utilizes an ultrashort-pulse laser (10 ps) to process hard and brittle materials.
Product range: NanoWork stencils (nanocoated SMD stencils) for optimized aspect and area ratios, excellent solder paste release, significant less cleaning cycles on bottom side SMD stencils, PatchWork stencils (step-up, step-down-stencils), wafer bumping stencils, repair/reballing stencils, LTCC/via fill stencils.
LaserJob Postings
9 products »
Laser cut stainless steel stencil with etched areas. When huge open spaces have to be produced on the bottom side of a stencil, the etching technology is one opportunity to realize it. The apertures for the solder paste print process a...
Repair Stencils and Reballing Stencils
Repair stencils and Reballing stencils in a lasercuting and laserwelding production process Since more than 10 years LaserJob is manufacturing repair stencils in a lasercut and laserwelding process. With the introducti...
Laser cut stainless steel Adhesive Stencil for adhesive printing. Adhesive stencils are used to solder SMD components with a solder wave, whereas the components are fixed with an adhesive. The adhesive spots are print in one printing p...
Via Fill Laser Cut LTCC Stencils
Lasercut LTCC-stencil (Low Temperature Cofired Ceramic) The LTCC-technology (low temperature co-fired ceramic) is used in the hybrid-technique when several interconnection levels are realized. The connec...
Laser cut stainless steel stencil for solder paste printing on wafer. Wafer bumping stencils are characterized by a high number of apertures which lie close together in the size of 90µm x 110µm. A package d...
3D-PatchWork® - Laser Cut 3D-Step Stencils
With the 3D-PatchWork® - stencil from LaserJob it is possible to print simultaneous on several levels of the PCB. Height differences from 10µm up to 2mm are realized with the PatchWork - Technology. At a...
PatchWork® - Laser Cut Step Stencils
Step-up / Step-down Stencil. The patented step stencil from LaserJob, called PatchWork® - stencil, was developed to print in one printing step different paste deposit heights. Due to the multiplici...
NanoWork® - Laser Cut Stencils With Anti-Adhesion Properties
Laser cut stainless steel stencil with nano coating from LaserJob. The patented NanoWork - stencil from LaserJob is based on a laser cut SMD stencil. Since 2007 LaserJob coates SMD - stencils and step...
LaserJob has been manufacturing laser cut SMD stencils for last 20 years. In strained condition with a cutting opening of 20µm an aperture size accuracy of ±3µm and an aperture positioning accur...
1 technical article »
Challenges for Step Stencils with Design Guidelines for Solder Paste Printing
Aug 25, 2015 | Carmina Läntzsch, Georg Kleemann
The stencil printing process is one of the most critical processes in the electronic production. Due to the requirement: "faster and smaller" it is necessary to place components with different paste volume close together without regard to solder paste printing. In our days it is no longer possible to control the solder paste volume only by adjustment of the aperture dimensions. The requirements of solder paste volumes for specific components are realized by different thicknesses of metal sheets in one stencil with so called step stencils. The step-down stencil is required when it is desirable to print fine-pitch devices using a thinner stencil foil, but print other devices using a thicker stencil foil.
The paper presents the innovative technology of step-up and step-down stencils in a laser cutting and laser welding process. The step-up/step-down stencil is a special development for the adjustment of solder paste quantity, fulfilling the needs of placement and soldering. This includes the laser cutting and laser welding process as well as the resulting stencil characteristics and the potential of the printing process....
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