Budapest University of Technology and Economics

BME is considered the world's oldest Institute of Technology which has university rank and structure. It was the first institute in Europe to train engineers at university level.

School

The Budapest University of Technology and Economics (BME), as one of the greatest Hungarian higher education institutions regards its mission the differentiated, multi-level, wide base quality education, elite-training, research and development, based on a strong primary training corresponding to social demands and the general development of science.

Aim of BME is the high level university and college basic training, professional further training, scientific training, and scientific qualification on several fields of natural and technical sciences, of the inanimate and animate natural sciences as well as social sciences.

Department of Electronics Technology

The Department of Electronics Technology was established in 1964 to teach and research the different fields of materials science, physical design and technology for the benefit of the electronics industry. The Department makes efforts to be a good partner of the industry in supplying skilful engineers, organizing postgraduate courses and training, carrying out research and development projects; and providing solutions of different topics of microelectronics and technology.

In the field of education the mission of the Department of Electronics Technology is to teach the knowledge of technology for students of electrical engineering and technical informatics. Since electronics technology is the knowledge associated with or applied to the realization of electronic components, circuits and systems, and seeing that today's electronics is microelectronics, in the last decade the Department has directed its energies towards the education of microelectronics packaging and interconnection technology, including printed wiring board technology; thin and thick films; hybrid circuits; multichip modules; component assembly; encapsulation techniques and thermal management; sensors, actuators and displays; laser technology; reliability and quality management; computer aided design and manufacturing; computer integrated manufacturing and production control.

In the field of research the Department of Electronics Technology lays special emphasis on the interconnection and packaging technology of microelectronics circuit modules and systems, which acts as a driving engine for continued progress in electronics in the third millennium. Sponsored by an INCO-Copernicus Project of the European Committee and a couple of projects of the Ministry of Education, the National Committee of Technological Developments, companies and foundations of Hungary, the Department developed prototyping facility and processing technologies for low cost laminated multichip modules (MCM-Ls) for the benefit of small enterprises of the European industry.

Budapest University of Technology and Economics Postings

2 technical articles »

Investigation of the Mechanical Properties of Mn-Alloyed Tin-Silver-Copper Solder Solidified with Different Cooling Rates

Sep 08, 2021 | Tamás Hurtony, Oliver Krammer, Balázs Illés, Gábor Harsányi, David Bušek and Karel Dušek

Manganese can be an optimal alloying addition in lead-free SAC (SnAgCu) solder alloys because of its low price and harmless nature. In this research, the mechanical properties of the novel SAC0307 (Sn/Ag0.3/Cu0.7) alloyed with 0.7 wt.% Mn (designated as SAC0307-Mn07) and those of the traditionally used SAC305 (Sn96.5/Ag3/Cu0.5) solder alloys were investigated by analyzing the shear force and Vickers hardness of reflowed solder balls. During the preparation of the reflowed solder balls, different cooling rates were used in the range from 2.7 K/s to 14.7 K/s....

Stencil Design Guidelines for Electronics Assembly Technologies.

Mar 13, 2014 | Budapest University of Technology and Economics Department of Electronics Technology

A student competition paper at Budapest University of Technology And Economics, Department of Electronics Technology gives background, covers stencil design and discusses stencils intended for pin in paste application. The stencil applied for depositing the solder paste is a thin, 75–200 µm thick metal foil, on which apertures are formed according to the solder pads on the printed circuit board. Stencil printing provides a fast, mass solder paste deposition process; relatively expensive, appropriate and recommended for mass production....

Voidless Reflow Soldering

Surface Insulation Resistance