Die Products Consortium
The Die Products Consortium (DPC) is a group of leading microelectronic companies collaborating to expand the market for semiconductor die products.
The DPC is focused on technology solutions for testing, reliability screening, standards, and more. Member companies are working together to seperately develop more competitive solutions for customers. DPC projects are aimed to enhance member companies' ability to keep pace with changes in technology, enhance current products and leverage a common understanding of emerging opportunities.
Membership in the DPC offers opportunities to network with the top IDMs in the industry. Member companies solidify current relationships and establish new relationships with industry partners and customers.
Member Companies:
- IBM
- Intel
- GlobalFoundries
- LSI
- Samsung
- Texas Instruments
The DPC is open to new participants.
Die Products Consortium Postings
1 technical article »
Challenges in Bare Die Mounting
May 08, 2014 | Larry Gilg, Die Products Consortium.
Bare die mounting on multi-device substrates has been in use in the microelectronics industry since the 1960s. The aerospace industry’s hybrid modules and IBM’s Solid Logic Technology were early implementations that were developed in the 1960’s. The technologies progressed on a steady level until the mid 1990’s when, with the advent of BGA packaging and chip scale packages, the microelectronics industry started a wholesale move to area array packaging. This paper outlines the challenges for both traditional wire-bond die attached to a printed wiring board (pwb), to the more recent applications of bumped die attached to a high performance substrate....
