SMT Equipment

TG-1000 Hot Bar Bonding System for Larger Displays or Substrates

Company Information:

Toddco3 manufactures automated assembly equipment for the electronics industry that ACF bonds, solders or welds flexible circuits, glass, PCBs or metals.

Menifee, California, USA

Manufacturer

  • Phone 1.619.286.3326

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Company Postings:

(3) products in the catalog

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TG-1000 Hot Bar Bonding System for Larger Displays or Substrates

TG-1000 Hot Bar Bonding System for Larger Displays or Substrates

Name:

TG-1000 Hot Bar Bonding System for Larger Displays or Substrates

Category:

Assembly Services

Offered by:

Toddco3

   

TG-1000 Hot Bar Bonding System for Larger Displays or Substrates Description:

TG-1000 Hot Bar Bonding System
TG-1000 is a feature rich, floor standing bonding system designed for process development and high mix production environments. Standard features include:
• Floor standing base frame & leveling legs with righ or left side load/unload position
• Computer Control System with fanless panel-PC, Windows Embedded & system software for intuitive menu driven operation and data logging of real-time process parameters
• Integrated 12 in. touch screen display for real-time display of process parameters and optics
• Process steps easily stored for recall which reduces change-over time in high-mix production
• Look-down or Look-up Camera systems available for vision aided alignment
• Motorized X-Y glass transport for load and bond positions with manual and programmable motion
• Motorized motion control system allows virtually unlimited number of programmable Load, Align, Bond and Unload positions to be saved with bond profiles for complete process control
• Closed loop temperature controller for rapid thermal cycling of ceramic hot bars
• G3 Ceramic Hot Bars provide dynamic thermal cycling and high precision planarity for ACF bonding
• Modular hot bar mount assemblies allow hot bars to be switched quickly and efficiently
• Servo Z-actuator for precise high and low pressure control
• Compressed air or nitrogen cooled bond area to maximize through-put
• Variety of modular options for manual or automated alignment features
• Customized tooling for process specific requirements

TG-1000 Hot Bar Bonding System for Larger Displays or Substrates was added in Nov 2014

TG-1000 Hot Bar Bonding System for Larger Displays or Substrates has been viewed 389 times

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