SMT Equipment

Pulsed Heat HBR/HSC/ACF Bonding System

Company Information:

Plastlist is a professional industrial solution provider, who is in engaged in design, manufacturing, equipment agency, material & accessories supply.

Taichung, Taiwan

Consultant / Service Provider, Manufacturer

  • Phone 886-423-260-632

See Supplier Website »

Company Postings:

(23) SMT parts, accessories & PCB supplies items

(164) products in the catalog

Pulsed Heat HBR/HSC/ACF Bonding System

Pulsed Heat HBR/HSC/ACF Bonding System

Name:

Pulsed Heat HBR/HSC/ACF Bonding System

Category:

Soldering Robots

Offered by:

Plastlist Group

   

Pulsed Heat HBR/HSC/ACF Bonding System Description:

Pulsed Heat HBR/HSC/ACF Bonding System

SYSTEM SPECIFICATIONS

Dimensions (Without signal tower)

750 mm x 760 mm x 558 mm

Weight (Not including the CCD and LCD monitor)

88 Kg

Power consumption

220V / 60Hz or 110V / 50Hz, 2KVA (Factory preset)

Air supply

4 to 6 Kg/cm2

Maximum fixture height

48 mm

Fixture assembly baseplate

150 mm x 150 mm ( 1 sets)

Starting operation method

Two hand control

Turntable actuation

Pneumatic (PBS212); Manual (PBS202)

Vacuum for components holding

1 sets; built-in

Password

6 digits (2-level)

THERMODE SPECIFICATIONS

Force range

30 N to 500 N

Force accuracy

±2 N

Actuation type

Pneumatic

Thermode stroke

50 mm maximum

Thermode length

100 mm maximum

PULSED HEAT CONTROL SPECIFICATIONS

Heating method

Pulsed heating, high speed PID control

Temperature range preheat

50 to 500℃ (1 degree increment)

Temperature range heat

50 to 500 ℃(1 degree increment)

Time period preheat

1 to 60 seconds (1 second increment)

Time period heat

1 to 60 seconds (1 second increment)

Temperature accuracy

±2℃

Programmable heat profile

3 programs, non-volatile

Thermocouple

K type

Communication port

RS-232C

Pulsed Heat HBR/HSC/ACF Bonding System was added in Jun 2018

Pulsed Heat HBR/HSC/ACF Bonding System has been viewed 513 times

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