Pulsed Heat HBR/HSC/ACF Bonding System
Company Information:
Name: |
Pulsed Heat HBR/HSC/ACF Bonding System |
Category: |
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Pulsed Heat HBR/HSC/ACF Bonding System Description:
Pulsed Heat HBR/HSC/ACF Bonding System
SYSTEM SPECIFICATIONS |
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Dimensions (Without signal tower) |
750 mm x 760 mm x 558 mm |
Weight (Not including the CCD and LCD monitor) |
88 Kg |
Power consumption |
220V / 60Hz or 110V / 50Hz, 2KVA (Factory preset) |
Air supply |
4 to 6 Kg/cm2 |
Maximum fixture height |
48 mm |
Fixture assembly baseplate |
150 mm x 150 mm ( 1 sets) |
Starting operation method |
Two hand control |
Turntable actuation |
Pneumatic (PBS212); Manual (PBS202) |
Vacuum for components holding |
1 sets; built-in |
Password |
6 digits (2-level) |
THERMODE SPECIFICATIONS |
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Force range |
30 N to 500 N |
Force accuracy |
±2 N |
Actuation type |
Pneumatic |
Thermode stroke |
50 mm maximum |
Thermode length |
100 mm maximum |
PULSED HEAT CONTROL SPECIFICATIONS |
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Heating method |
Pulsed heating, high speed PID control |
Temperature range preheat |
50 to 500℃ (1 degree increment) |
Temperature range heat |
50 to 500 ℃(1 degree increment) |
Time period preheat |
1 to 60 seconds (1 second increment) |
Time period heat |
1 to 60 seconds (1 second increment) |
Temperature accuracy |
±2℃ |
Programmable heat profile |
3 programs, non-volatile |
Thermocouple |
K type |
Communication port |
RS-232C |
Pulsed Heat HBR/HSC/ACF Bonding System was added in Jun 2018
Pulsed Heat HBR/HSC/ACF Bonding System has been viewed 513 times
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