ALPHA® Solder Paste
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ALPHA® Solder Paste |
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ALPHA® Solder Paste Description:
Alpha® offers a full line of technologically advanced solder pastes developed to provide high throughput and yield, and lowest cost of ownership for a wide range of applications. Our offering includes leading lead-free, no-clean, halogen-free solder paste technologies for applications such as fine feature printing, low temperature processing, and many others. Alpha’s® solder pastes are available in a wide range of alloy offerings, including low-Ag SACX Plus® that offers excellent soldering performance at an alloy cost approximately 30% less than SAC305. The SACX Plus® alloy is also offered in Alpha® solder bar, preforms, wire, and spheres for assured alloy compatibility and stronger solder joints. Alpha’s® solder pastes conform to our customers’ unique processes, as well as the challenging environmental regulations they are required to follow.
Alpha solder pastes are used in the assembly of printed circuit boards (PCBs) for a wide variety of applications, including hand-held electronic devices such as smart phones and tablets, computer motherboards, consumer electronic products, network servers, automotive systems, medical and military equipment and many others.
Alpha® solder paste technology leaders*:
ALPHA® CVP-520: zero halogen, low melting point lead-free alloy enables excellent pin-in-through-hole soldering performance and reflow soldering of temperature sensitive through-hole components, potentially eliminating wave soldering in mixed technology applications.
ALPHA® OM-363: excellent fine feature printing and pin test capability; significantly decreases the non-wet open (NWO) and head-in-pillow (HIP) defects.
Solder Pastes Selector Guide:
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Universal, Highest Print Speed |
ALPHA® OM-338 T |
• | • | • | • | 88.5% | M13 | ROL0 |
88.3% M04 |
ND | |||||||||||
| Universal, Pin Testable, Enclosed Print Heads |
ALPHA® OM-338 PT |
• | • | • | • | 88.5% | M15 | ROL0 | NA | ND | ||||||||||||
| Enabling 0.4mm BGA Assembly |
ALPHA® OM-338 CSP |
• | • | • | 88.3% | M11 | ROL0 |
83.5% M04 |
ND | |||||||||||||
| High Soak Profile, Paste in Through Hole |
ALPHA® CVP-390 |
• | • | • | • | • | • | • | • | • | • |
88.8%, 89% |
M17 M20 |
ROL0 | TBD | ND | ||||||
| Increased Spread Wetting, Excellent HIP |
ALPHA® OM-340 |
• | • | • | • | • | • | • | • | • | • | 88.3% | M18 | ROL0 | NA | ND | ||||||
| Universal Water Soluble |
ALPHA® WS-820 |
• | • | • | • | • | • | 88.0% | M19 | ORH0 |
85% M9 |
NA | ||||||||||
| Low Melting Point Water Soluble |
ALPHA® WS-852 |
• | • | • | 90% | M18 | ORH0 | NA | NA | |||||||||||||
| High Value Pin Testable SACX Alloy |
ALPHA® CVP-360 |
• | • | • | • | 88.5% | M15 | ROM0 |
83.3% M04 |
<900 ppm |
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| Package-on-Package Dip Paste |
ALPHA® PoP-33 |
• | • | • | 77.5% | M05 | ROL0 | NA | ND | |||||||||||||
| Package-on-Package Dip Tacky Flux |
ALPHA® PoP-707 |
NA | NA | NA | NA | ND | ||||||||||||||||
| Jetting Solder Paste |
ALPHA® JP-500 |
• | • | • | 87% | M11 | ROL0 | NA | ND | |||||||||||||
| Excellent paste in through hole performance, low melting point alloy |
ALPHA® CVP-520 |
• | • | • | 90% | M21 | ROL0 |
85.3% M04 |
ND | |||||||||||||
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Solder Paste |
ALPHA® OM-5300 |
• | • | • | • | • | 90% | M17 | ROL0 | NA | ND | ||||||||||
| Universal, Wide Process Window |
ALPHA® OM-5100 |
• | • | • | • | • | 90.0% | M13 | ROL0 |
85% M04 |
ND | |||||||||||
| Universal Dispense Paste |
ALPHA® CL-78 |
• | • | • | • | • | 85.0% | M04 | ROL0 |
85% M04 |
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| Stencil Life, Joint Cosmetics, Cleanability |
ALPHA® WS-809 |
• | • | • | • | 90.0% | M18 | ORH0 | NA | NA | ||||||||||||
ALPHA® Solder Paste was added in Sep 2014
ALPHA® Solder Paste has been viewed 3669 times
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