Die Bumping Services
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Die Bumping Services |
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Die Bumping Services Description:
We can bump single die in geometries as small as 30um. CVI will add a UBM on aluminum and copper pads follewed by solder bump in Sn and In alloys. CVI can then attach the die to a substrate or PCB followed by complete assembly.
Die Bumping Services was added in Sep 2014
Die Bumping Services has been viewed 546 times
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