Firan Technology Group

FTG is a leading North American manufacturer of high technology printed circuit boards and precision illuminated display systems.

Manufacturer of Assembled PCBs, Contract Manufacturer, Service Provider

FTG has manufactured complex mil-spec and specialty printed circuit boards for the Telecom, Medical, Avionics, Military and Advanced Test markets for over three decades. Our commitment to innovation and one-on-one partnering assures you the level of service and quality you want, while quick-turn prototype and production runs guarantee on-time delivery.

With facilities in Canada, and representation in the U.S. and Europe, FTG provides a broad range of integrated design and manufacturing services in a one-stop-shop offering.

Firan Technology Group Postings

2 technical articles »

Impact of Assembly Cycles on Copper Wrap Plating

Jul 22, 2020 | Hardeep Heer, Ryan Wong, et al

The PWB industry needs to complete reliability testing in order to define the minimum copper wrap plating thickness requirement for confirming the reliability of PTH structures. Predicting reliability must ensure that the failure mechanism is demonstrated as a wear-out failure mode because a plating wrap failure is unpredictable. The purpose of this study was to quantify the effects of various copper wrap plating thicknesses through IST testing followed by micro sectioning to determine the failure mechanism and identify the minimum copper wrap thickness required for a reliable PWB. Minimum copper wrap plating thickness has become an even a bigger concern since designers started designing HDI products with buried vias, microvias and through filled vias all in one design. PWBs go through multiple plating cycles requiring planarization after each plating cycle to keep the surface copper to a manageable thickness for etching. The companies started a project to study the relationship between Copper wrap plating thickness and via reliability. The project had two phases. This paper will present findings from both Phase 1 and Phase 2....

Reliability of Stacked Microvia

May 14, 2015 | Hardeep Heer, Ryan Wong

The Printed Circuit Board industry has seen a steady reduction in pitch from 1.0mm to 0.4mm; a segment of the industry is even using or considering a 0.25mm pitch. This has increased the use of stacked microvias in these designs. The process of stacking microvias has been practiced for several years in handheld devices; however, the devices generally do not operate in harsh conditions. Type 1 and Type 2 microvias have been tested over the years and have been found to be very reliable. We do not have enough test data for 3 and 4 stack microvias when placed on and off buried via. The main objective of this study was to understand the reliability of 3 and 4 stack microvias placed on and off a buried via....

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