From our humble beginning as a small surface mount package tape and reel service company, Syagrus Systems has grown with our customer’s needs into a post-fab “back end” wafer to die processing company. Syagrus Systems has been at the forefront of semiconductor processing solutions in the areas of ultra thin wafer backgrinding services, wafer dicing services, automated die inspection, and die pick and place to a variety of different outputs as specified by our customers.
Within these markets, we work with some of the world’s leading companies that are on the cutting edge of technology. Our wafer service offerings enable our customers to bring their products to market faster by transitioning their semiconductor wafers from full wafer form to usable die form, quickly and in the exact specifications they require. Request a quote today for die processing or wafer dicing services, or SMD packaging services.
Each program we can help improve through our technology and services, Syagrus Systems comes closer to meeting our own mission. Let us help you meet yours. Contact us today to get started on bringing your leading edge technology and concepts to life.
We have become a leader in our business segment by listening to our customers' needs, working with them to create the solution and then exceeding their expectations. Let Syagrus Systems be part of your engineering team helping you bring your products to market faster and gain the competitive edge. Our focus is to help you transition your product from wafer form to usable die form quickly, meeting your critical deadline.
- Multidie or "Pizza Mask" Wafers
- Bumped Wafers
- Low Volume Engineering Runs
A variety of services are provided to meet your needs. All services are designed to be "consistently flexible", in that we can easily modify our processes and react quickly to your needs, while documenting each step for consistency and repeatability. Syagrus Systems customer base is very diverse and represents all segments of the semiconductor industry including telecommmunications, military and aerospace, medical and commercial. We proudly work with some of the industry's largest companies as well as the smallest innovative start up and fabless semiconductor companies. Services include:
- Wafer Bonding
- Automated Wafer Backgrinding
- Automated Wafer Dicing
- Automated and Manual Die Visual Inspection
- Automated and Manual Die Sort
We also provide a selection of services for your surface mount package die, such as:
- Component Bake
- Tape and Reel Packaging
- Dry Packaging with Custom Labeling
Syagrus Systems Postings
The 3M Wafer Support SystemTM provides a temporary bonding solution to support wafers during conventional thinning operations as well as post thinning operations. The 3M UV curable adhesive is spun on the wafer surface and is used as a bondin...
Syagrus Systems has a long history in providing superior wafer and die visual inspection services to the semiconductor industry. Syagrus Systems features fully automated wafer inspection systems as well as the flexibility of manual wafer ins...
Our fully automated silicon wafer dicing service consistently meet the tight requirements expected in our industry and demanded by our customers. At Syagrus Systems, we know that a good wafer dicing or wafer cutting process sets the pace for all r...
Syagrus Systems uses the 3M Wafer Support System to meet the demands of today's technology companies for extremely thin silicon wafers and die used in complex applications. We have over 15 years of silicon wafer thinning...
To compliment our wafer dicing and inspection processes, Syagrus Systems offers fully automated die sorting services. Whether you require high volume production or a single wafer prototype build, Syagrus Systems has the die sorting solution...
Syagrus Systems specializes in high mix low volume surface mount device (SMD) tape and reel packaging to support component distributors and OEM's. We offer the highest quality SMD tape and reel services available, and at lower costs than most...