Durostone® PCB solder pallets

Durostone® PCB solder pallets Description:

Durostone® Solder pallets Durostone® Solder pallets - perfectly machined

A good example to show the precision of our machining are Durostone® PCB solder pallets. They are used to fix electronic components on printed circuit boads using the wave soldering process. The design of the solder pallets is exactly adjusted to the design of the printed circute board.

Durostone® PCB Solder Pallet Materials

Durostone® materials have been developed for all procedures within the PCB assembly process. There are three main grades which are suitable for use in the SMT reflow and wave soldering processes, Durostone® CHP760, CAS761 & CAG762.

These materials offer the following features:

• Excellent mechanical properties at elevated temperatures including the lead-free process.
• Low thermal conductivity.
• Excellent machining properties enabling the manufacture of complex design solder pallets.
• Good resistance to chemicals used in modern s

Durostone® Harsh environments

• A combination of flux, temperature and process cycles can result in the degradation of the standard Durostone® grades of material. The solution is Durostone® CFR767 which has been specifically formulated for use with aggressive fluxes and high process temperatures.

  The resin used to produce Durostone® CFR767 can withstand temperatures up to 300°C. The decision to use Durostone® CFR767 over one of the standard grades is made when the solder bath temperature exceeds 265°C and the bottom side PCB pre-heat exceeds 140°C.

  Durostone® CFR767 has excellent flux resistance. When fluxes containing halides or dicarboxylic acids are used in high volume production the lifespan of the standard grades of material can be reduced so Durostone® CFR767 is an ideal solution.

RoeChling Durostone Data Sheet

Technical DataCHP760CAS761CAG762CFR767

GradeStandardAnti-StaticAnti-Static OpticalFlux Resistant

ColourBlueBlackGreyBordeaux (Red)

Density (g/cm 3)1.851.851.851.8

Flexural Strength 3 point support23°C360360360380

 (MPa)150°C180180180260

 185°C---150

Modulus of Elasticity (MPa)23°C18,00018,00018,00018,000

150°C9,0009,0009,00014,000

185°C---10,000

Water Absorption (%)< 0.20< 0.20< 0.20< 0.20

Coefficient of Linear Expansion (10-⁶/K)13111111

between 30°C & 200°C

Thermal Conductivity (W/m°K)0.250.250.250.23

Maximum Operating Temperature (°C)300300300380

10 – 20 seconds

Standard Operating Temperature (°C)260260260300

Surface Resistivity (ohms)-10⁵  - 10⁹10⁵  - 10⁹10⁵  - 10⁹

Chemical ResistanceGoodGoodGoodExcellent

Sheet Size (mm)2440 x 1220

Thickness’ available (mm)3, 4, 5, 6, 8, 10, 125, 6, 8, 10

Thickness Tolerance3 mm-0 / +0.10

Thickness Tolerance4 – 12 mm -0 / +0.20

Flatness Tolerance0.2

(for a panel size of 300 x 300)

Parallelism0.1