The BEST EZReball™ process is the answer to your reballing problems. This BGA reballing process simplifies the process while eliminating the clean up of all those paper remnants, allowing for better yields and faster reballing times.
The simplicity of the EZReball™ reballing process allows even the beginning repair technician to reliably and quickly replace balls on a BGA package. By aligning the edges of the preform and the package the two are “squared up” thereby eliminating the need to buy custom fixtures or frames. The adhesive is engineered such that the balls are firmly held in place until after reflow thereby reducing the problem of missing solder balls found in other techniques. After the device has been reflowed, the BGA reballing preform is simply peeled off, eliminating the time required in cleaning off residual paper
EZReball(TM) was added in May 2016
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