IPC-8 series Lead-Free Hot Air Reflow System
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IPC-8 series Lead-Free Hot Air Reflow System Description:
IPC-8 series reflow oven adopts advanced technology and inspection standard of IPC-985X (evaluation of reflow oven), which fully satisfy the temperature profile requirement of IPC-7530 (Guidelines for Temperature Profiling for Mass Soldering Processes) and IPC/JEDEC J-STD-020C(Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices), providing powerful equipment and technology guarantee for production and processing, and the most valuable product and service for engterprises.
Technical Parameters:
- Cooling Type: Air Cooling
- Temp.Accuracy: Emhanced P.I.D.Control
- Reiteration Accuracy: Under continual production, the difference of temperature on different board is±1℃
- Machine Reiteration: Under the same technics parameter setting,the reiteration of temperature profile on different stages is ±1℃
- PCB Temp Deviation: ±1℃
IPC-8 series models:
- 8, 10, 12 heating zone
- nitrogen (option)
- air or water cooling (option)
IPC-8 series Lead-Free Hot Air Reflow System was added in Dec 2016
IPC-8 series Lead-Free Hot Air Reflow System has been viewed 1050 times
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