Big-Size Vacuum Soldering Oven for IGBT, MOS

Big-Size Vacuum Soldering Oven for IGBT, MOS Description:

              Big-Size Vacuum Soldering Oven  for IGBT, MOS

1.Reflow soldering  
Typically high number of voids cause a large non conductive area

2.Vacuum soldering 
Very low number of voids, Typically < 2 %  leads to best Thermal Conduction

3.Applications

Power Semiconductors;Hybrid Microelectronic Assembly;UHB LED´s;BGA  Flip Chip;Hermetic Seals  Optoelectro;

Optoelectronic Package;Wafer Level Bump;MEMS;IGBT 

4.Visual Monitoring Analysis System
Siemens PLC and Industrial Personal Computer
Low Vacuum :5*10ˉ¹Pa
High Vacuum : 5*10ˉ³ Pa
Welding area : 400x 300 mm
Furnace height :100mm 
Max soldering temperature : 450°C
Warm-up rate :180°C /min 
Cooling rate : ≥120℃/min  
Drawer bearing : 120KG
Heating platform :    graphite &special treatment
Flux : Formic acid type ( standred )
Monitoring window :  5 sets visual window