SMT Equipment

High Temperature Reflow Oven with Vacuum Situation for IGBT

High Temperature Reflow Oven with Vacuum Situation for IGBT

High Temperature Reflow Oven with Vacuum Situation for IGBT

Name:

High Temperature Reflow Oven with Vacuum Situation for IGBT

Category:

Soldering - Other

Offered by:

Beijing Chengliankaida Technology Co.,Ltd

   

High Temperature Reflow Oven with Vacuum Situation for IGBT Description:

         High Temperature Reflow Oven with Vacuum Situation for IGBT  KD-V20

Application :

 IGBT module  

 MEMS 

 Large power modules package

 Optoelectronic package  

 Hermetic Seals 

Feature :

1. Viewing system: Cavity with a visual window, can observe the welding process in real time. 

2. Up and down heating system : Equipped with current regulator,can control dynamic temperature with high accuracy respectively. It ensures the temperature of the bearing platform uniform.

3. Vacuum system :Equipped with direct connection high speed rotary vacuum pump,  the charge vacuum can realize 1pa rapaidly .

4. Cooling system :Adopt water cooling system, ensure it can cooling rapidly in high temperature environment.

5. Software system :Raise or decrease temperature can be controlled by programming, it can set temperature up/down curve according to the technology. Each curve can generate automatically, programmable, can be modified and stored.

6. Control system :Software modular design can set the process curve independently, vacuum extraction, atmosphere, cooling, etc., and can be combined with the production process, to achieve a key operation.

7. Data recording system :With continuous real-time monitoring and data recording system, software curve records, temperature control curve saving, process parameters saving , equipment parameters records .

8. Rapid cooling rate :Independent water cooling and gas cooling device is set in the cavity, achieve rapid cooling of the device.

9. Low hole rate of welding quality :To ensure that after welding, a large area of the disc to achieve the following 3% hole rate.

10. The whole machine struture : econvenience for maintenance . The hearing parts maintain work and the Flux clean recycling work are done by one person easily .Replace the heating pipe only within 2 minutes .

11. Protection system: according to the many years experience in this field , multiple protection system  customers can rest assured . 

Technology data :

Basic data

Outlook dimension

900 x 800 x 1300 mm (LxWxH)  Weight:about  200 kg

Low vacuum

1Pa

Welding area

200x 160mm

Charge height

100mm

Temperature range

Highest can be up to 450°C

Temperature Warm-up rate

Highest can be up to 120°C /min

Temperature Cooling rate

≥120℃/min

Temperature uniformity

±2%

Charge bearing

5kW   Bottom heating system

Heating platform

Special handling heating platform

Power source standards

380V, 50HZ/60HZ

Current

.max. 3 x20 A, 50-60 HZ

Control parameters

Controlling way

Siemens PLC + IPC

Monitoring window

 With visual window (1 set )

Temperature curve setting

Temperature & time (can set temperature /time/ warm-up rete,, 150 technical stages can be set at most )

Joint

COM

Option

Welding vision inspection system

※Optional with 50-200 magnification, observation, analysis of the welding process

※Software video recording function , convenience for the R&D and  process analysis

Security system

Ultra high temperature alarm, excessive temperature raising alarm

System self-check function, each function is the normal state before production , the program allows operate    

Cooling water pressure test system, low voltage alarm, software remind

One-click to cut off the heating part power supply

High Temperature Reflow Oven with Vacuum Situation for IGBT was added in May 2017

High Temperature Reflow Oven with Vacuum Situation for IGBT has been viewed 638 times

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