Tianjin Reains Technologies Co., Ltd

Reains Underfilm is a patented Technology which pre-formed thermoplastic, It corner or edge bonds BGA/LGA/CSP packages to the PCB to improve solder joint reliability. It tape & reel packed and fully automatic pick & place on PCB.

Adhesives / Dispensing

Dual Lane Reflow Oven

Shenzhen ETA N2 Reflow Oven