Tianjin Reains Technologies Co., Ltd

Reains Underfilm is a patented Technology which pre-formed thermoplastic, It corner or edge bonds BGA/LGA/CSP packages to the PCB to improve solder joint reliability. It tape & reel packed and fully automatic pick & place on PCB.


StikNPeelâ„¢ Rework Stencils

Selective Conformal Coating System - GPD SimpleCoat