SMT Equipment

3D SPI Offline Machine T-3010a

Company Information:

The Art of the stencil printing process is made up many variables. Controlling those variables through dedicated DOE and SPI monitoring will guarantee a yield improvement strategy you can take to the bank!

ShenZhen, China

Consultant / Service Provider, Manufacturer

  • Phone 15115589239

See Supplier Website »

Company Postings:

(9) products in the catalog

3D SPI Offline Machine T-3010a

3D SPI Offline Machine T-3010a


3D SPI Offline Machine T-3010a



Offered by:

ShenZhen Sinic-Tek Vision Technology Limited


3D SPI Offline Machine T-3010a Description:


1.The use of PSLM combined with the PMP to achieve 100% high-precision solder paste 3D measurement in SMT production line.

2.Using PSLM technology, changed the traditional way of generating 3D Struct Light, the traditional glass grating moire required mechanically driven by a piezoelectric motor(PZT).By using PSLM, no need glass grating and mechanical parts any more. The elimination of the mechanical drive and moving parts, greatly improving the ease of use and avoid mechanical wear and reduce maintenance costs.

3.By using the Stop&Catch methods combined with multiple image acquisition, realize highly repeatable 3D results on the solder paste measurement. Compared to conventional scanning just take one pictures only on the solder paste a scan sampling, multiple image acquisition greatly enhancing the accuracy and reliable test results.

4.Patened D-Lighting technology achieves full light spectrum detect ability. It is perfect solution to solve the shadow effect and reduce noise interference during 3D measurement.

5.Gerber data conversion and import, achieve automatic detection of the entire board. Manual “teach” function realize user-friendly programming and test job generation in case of no Gerber data situation.

6. The maximum detectable height increased from the traditional ±350um to±1200um, not only can detect solder paste, also applies to the detection of opaque objects, such as red glue and black epoxy and other none transported object.

7.Friendly and simple user interface, five minutes of programming and one key operation.

8.Powerful “statistical process control(SPC)”, Provide a plenty of tools, user-friendly real-time monitoring, reduce defects caused by poor solder paste printing and improve final product quality.

9.The application range like: mobile phones, tablet PC, computer and accessories, digital cameras, camcorders, automotive, medical, server, LED, etc.



Measurement Principle

3D white light PSLM PMP(Programmable Spatial Light Modulation,commonly 
known as moire fringe technology)


Volume,acreage,height, XY offset, shape  

Detection of Non - Performing 

Missing print,insufficient tin, excessive tin, bridging, offset,  mal-shapes, surface contamination

Camera Pixel

2M (4M as option)

FOV Size

26 X 20mm


XY direction):10um;    height:0.37um   


Height:<1um (4 Sigma);volume/acreage:<1%(5 Sigma)

Gage R&R

Far less than 10%

Inspection Speed


Quantity of Inspection Head

Single Head (Twin-heads as option)

Mark-point Detection Time

 0.5 sec/piece

Maximun Meauring Height

±350um (±1200um * as optipon)

Maximun Measuring Height 
of PCB Warp 


Minimum Pad Spacing

100um (pad height of 150um as the reference)

Smallest  Measuring Size

Rectangle:150um;    round:200um

Maximum Loading PCB Size

X700 x Y600 mm(1000*600mm as option)

Fixed or Flexible Orbit Setting

Front orbit

Engineering Statistics

Histogram;Xbar-R Chart;Xbar-S Chart;CP&CPK;%Gage Repartability 
Data;SPI Daily/Weekly/Monthly Reports

Gerber & CAD Data Import

Support Gerber format(274x,274d);manual Teach model ;
CAD X/Y,Part No.,Package Type imput)

Operating System Support 

Windows 7 Professional (32 bit)

Equipment Diemension 
and Weight

1500 x 1100 x 600mm;145KG


1D / 2D Barcode scanner;UPS continuous power supply;workstation 
(T-3010a except)

3D SPI Offline Machine T-3010a was added in Jan 2018

3D SPI Offline Machine T-3010a has been viewed 542 times

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