Sinic-Tek 3D SPI Online Machine L1200

Company Information:

The Art of the stencil printing process is made up many variables. Controlling those variables through dedicated DOE and SPI monitoring will guarantee a yield improvement strategy you can take to the bank!

ShenZhen, China

Consultant / Service Provider, Manufacturer

15115589239

See Supplier Website »

Company Postings:

(9) products in the catalog

Name:	Sinic-Tek 3D SPI Online Machine L1200
Category:	Inspection
Offered by:	ShenZhen Sinic-Tek Vision Technology Limited

Sinic-Tek 3D SPI Online Machine L1200 Description:

Features:

1.The use of PSLM combined with the PMP to achieve 100% high-precision solder paste 3D measurement in SMT production line.

2.Using PSLM technology, changed the traditional way of generating 3D Struct Light, the traditional glass grating moire required mechanically driven by a piezoelectric motor(PZT).By using PSLM, no need glass grating and mechanical parts any more. The elimination of the mechanical drive and moving parts, greatly improving the ease of use and avoid mechanical wear and reduce maintenance costs.

3.By using the Stop&Catch methods combined with multiple image acquisition, realize highly repeatable 3D results on the solder paste measurement. Compared to conventional scanning just take one pictures only on the solder paste a scan sampling, multiple image acquisition greatly enhancing the accuracy and reliable test results.

4.Patened D-Lighting technology achieves full light spectrum detect ability. It is perfect solution to solve the shadow effect and reduce noise interference during 3D measurement.

5.Gerber data conversion and import, achieve automatic detection of the entire board. Manual “teach” function realize user-friendly programming and test job generation in case of no Gerber data situation.

6. The maximum detectable height increased from the traditional±350um to±1200um, not only can detect solder paste, also applies to the detection of opaque objects, such as red glue and black epoxy and other none transported object.

7.Friendly and simple user interface, five minutes of programming and one key operation.

8.Powerful “statistical process control(SPC)”, Provide a plenty of tools, user-friendly real-time monitoring, reduce defects caused by poor solder paste printing and improve final product quality.

9.The application range like: mobile phones, tablet PC, computer and accessories, digital cameras, camcorders, automotive, medical, server, LED, FPC, communication products etc.

Products Description		1.2M model
Model		L1200
Measurement Principle		3D white light PSLM PMP(Programmable Spatial Light Modulation,commonly known as moire fringe technology)
Measurements		Volume,acreage,height, XYoffset, shape
Detection of Non - Performing Types		Missing print,insufficient tin, excessive tin, bridging, offset, mal-shapes, surface contamination
Camera Pixel		5M, 8M/12M as option
Lens Types		Telecentric lens, telephoto lens as option
Lens Resolution		18um(8/10/13/15/20um as option)
FOV Size		46.136.7mm (20.516.3/25.624.5/33.326.5/38.430.6/51.240.8mm)
Accuracy		XY Resolution):1um;Height:0.37um
Repeatability		Height:<1um (4 Sigma);volume/acreage:<1%(4 Sigma)
Gage R&R		<10%
FOV Speed		0.3s/FOV
Quantity of Inspection Head		Twin-Heads (Single Head, Tri-Heads as option)
Red Green Blue/RGB Three Colas Option Light Source		Standard configuration
Mark-point Detection Time		0.5 sec/piece
Compensation Plate Bending of Real-time Lift in Z-axis		Standard configuration
Maximun Meauring Height		±550um ( ±1200um as option)
Maximun Measuring Height of PCB Warp		±3.5mm (±5mm as option)
Minimum Pad Spacing		100um ( pad height of 150um as the reference)
Smallest Measuring Size		Rectangle:150um;Round:200um
Maximum Loading PCB Size		Single plate: X600Y550mm Two times plate: X1200Y550mm
Thickness of the PCB		0.4-7mm
Height Limitations of the Parts		Top40mm,Bottorm40mm
Board Edge Distance		5mm or 10mm
Flixble or Fixed Orbit Setting		Front orbit (Back orbit as option)
PCB Transfer Direction		Left to right or right to left, set before delivery
Orbit Width Adjustment		Manual, automatic as option
SPC Statistics		Histogram;Xbar-R Chart;Xbar-S Chart;CP&CPK;%Gage Repartability Data;SPI Daily/Weekly/Monthly Reports
Gerber & CAD Data Imput		Support Gerber format(274x,274d);Manual Teach model ; CAD X/Y,Part No.,Package Type imput
Computer type		DELL Precision Workstation
Computer Configuration	CPU	Intel 4-core (Intel 6-core as option)
	RAM	24G(32/64G as option)
	GPU	2G discrete graphics (4G DP as option)
	Hard disk	1T (2T as option)
	DVD+RW	Standard configuration
	Operating System	Windows 7 Professional ( 64 bit)
Equipment Diemension and Weight		W2000xD1200xH1525mm;1250KG
Power		220V,10A
Air Pressure		4~6Bar
Power (Start / nornmal)		Start:2.5kw / Normal operation:2kw
Loading Requirements of the Floor		600kg/m²
Options		Multifunctional clip edge, 1D / 2D Barcode scanner, Badmark function, print closed-loop control, out-line programming software, maintenance was optionkstations, dynamic Mark point read function, coaxial Mark point camera , UPS continuous power supply