SMT Equipment

Sinic-Tek High-Speed Inline SPI

Sinic-Tek  High-Speed Inline SPI

Sinic-Tek  High-Speed Inline SPI

Name:

Sinic-Tek High-Speed Inline SPI

Category:

Inspection

Offered by:

ShenZhen Sinic-Tek Vision Technology Limited

Company Information:

ShenZhen Sinic-Tek Vision Technology Limited

The Art of the stencil printing process is made up many variables. Controlling those variables through dedicated DOE and SPI monitoring will guarantee a yield improvement strategy you can take to the bank!

ShenZhen, China

Assembly, Inspection, Manufacturer of Test Equipment, Pick and Place, Test Services

  • Phone 15115589239

ShenZhen Sinic-Tek Vision Technology Limited website

Company Postings:

(9) products in the catalog

Sinic-Tek High-Speed Inline SPI Description:

High Precision Online 3D Solder Paste Inspection
Features:
1.The use of PSLM combined with the PMP to achieve 100% high-precision solder paste 3D measurement in SMT production line.
2.Using PSLM technology, changed the traditional way of generating 3D Struct Light, the traditional glass grating moire required mechanically driven by a piezoelectric motor(PZT).By using PSLM, no need glass grating and mechanical parts any more. The elimination of the mechanical drive and moving parts, greatly improving the ease of use and avoid mechanical wear and reduce maintenance costs.
3.By using the Stop&Catch methods combined with multiple image acquisition, realize highly repeatable 3D results on the solder paste measurement. Compared to conventional scanning just take one pictures only on the solder paste a scan sampling, multiple image acquisition greatly enhancing the accuracy and reliable test results.
4.Patened D-Lighting technology achieves full light spectrum detect ability. It is perfect solution to solve the shadow effect and reduce noise interference during 3D measurement.
5.Gerber data conversion and import, achieve automatic detection of the entire board. Manual "teach" function realize user-friendly programming and test job generation in case of no Gerber data situation.
6. The maximum detectable height increased from the traditional±350um to±1200um, not only can detect solder paste, also applies to the detection of opaque objects, such as red glue and black epoxy and other none transported object.
7.Friendly and simple user interface, five minutes of programming and one key operation.
8.Powerful "statistical process control(SPC)", Provide a plenty of tools, user-friendly real-time monitoring, reduce defects caused by poor solder paste printing and improve final product quality.
9.The application range like: mobile phones, tablet PC, computer and accessories, digital cameras, camcorders, automotive, medical, server, LED, FPC, communication products etc.

 
Model  S8030
Measurement Principle 3D white light PSLM PMP(Programmable Spatial Light Modulation,commonly 
known as moire fringe technology)
Measurements Volume,acreage,height, XYoffset, shape  
Detection of Non - Performing Types Missing print,insufficient tin, excessive tin, bridging, offset,  mal-shapes, surface 
contamination
Camera Pixel 4M
Lens Types Telephoto lens
Lens Resolution 20um(18/22um  as option)
FOV Size 40*40mm
Accuracy XY Resolution):1um;Height:0.37um
Repeatability Height:≤1um (3 Sigma);volume/acreage:<1%(3 Sigma)
Gage R&R <10%
FOV  Speed 0.40s/FOV
Quantity of Inspection Head Single Head (Twin-Heads as option)
Red Green Blue/RGB Three Colas 
Option Light Source
Standard  configuration
Mark-point Detection Time 0.5 sec/piece
Compensation Plate Bending 
of Real-time Lift in Z-axis
Standard  configuration
Maximun Meauring Height ±350um ( ±1200um as option)
Maximun Measuring Height 
of PCB Warp 
±3.5mm
Minimum Pad Spacing 150um ( pad height of 150um as the reference)
Smallest  Measuring Size Rectangle:150um;Round:200um
Maximum Loading PCB Size M:X330xY250mm
L:X480xY470mm
Thickness of the PCB 0.4-5mm
Height Limitations of the Parts Top30mm,Bottorm40mm
Board Edge Distance 3mm , (multifunctional clip edge  as option)
Flixble or Fixed Orbit Setting Front orbit  (back orbit as option)
PCB Transfer Direction Left to right or right to left
Orbit Width Adjustment Manual, automatic as option
SPC Statistics Histogram;Xbar-R Chart;Xbar-S Chart;CP&CPK;%Gage Repartability 
Data;SPI Daily/Weekly/Monthly Reports
Gerber & CAD Data Imput Support Gerber format(274x,274d);Manual Teach model ;
CAD X/Y,Part No.,Package Type imput
Computer type  DELL computer
CPU Intel 4-core
RAM 12G
GPU 1G discrete graphics 
Hard disk 1T 
DVD+RW Standard  configuration
Operating System  Windows 7 Professional ( 64 bit)
Equipment Diemension 
and Weight
S:1000x1000x1525mm;730KG
L:1000x1000x1525mm;780KG
Power 220V,10A
Air Pressure 4~6Bar
Power (Start / nornmal) Start:2.5kw /  Normal operation:2kw
Loading Requirements 
of the Floor
500kg/m²
Options Multifunctional clip edge, 1D / 2D Barcode scanner, Badmark function, print 
closed-loop control, out-line programming software, maintenance was 
optionkstations, dynamic  Mark point  read function, coaxial  Mark  point camera , 
UPS continuous power supply 
 

Sinic-Tek High-Speed Inline SPI was added in Jan 2018

Sinic-Tek High-Speed Inline SPI has been viewed 434 times

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