Folysky Technology(Wuhan)Co.,Ltd
Folysky Technology(Wuhan)Co.,Ltd, is a professional engaged in the plane and three-dimensional inorganic non metal based electronic circuits and electronic components research and development, production and sales of high-tech ent
Folysky Technology(Wuhan)Co.,Ltd Postings
30 products »
Ceramic Circuit Board With LED Heat Dissipation
Owing to the our immense experience and understanding in this particular market, we are Manufacturing and Supplying an excellent variety of Ceramic Circuit Board With Led Heat Dissipation And Long Service Life from Wuhan, Hubei, China. High bonding s...
Ceramic Circuit Board With LED Heat Dissipation
Owing to the our immense experience and understanding in this particular market, we are Manufacturing and Supplying an excellent variety of Ceramic Circuit Board With Led Heat Dissipation And Long Service Life from Wuhan, Hubei, China. High bonding s...
The Direct Sale of Sliton Ceramic Substrate
与普通PCB，Sliton陶瓷陶瓷更耐压，可深入智能照明、智能芯片、电子材料、航空航天、LED、传感器等领域。、规格和定制等。 产品名称：其他陶瓷PCB材料厚度：3mm 导电层：Cu 金属层厚度：100μm 表面处理：OSP 金属单面/双面：双面 镀铜通孔：无 阻焊：无...
基础厚度：0.38mm 导电层：铜 金属层厚度：100μm/35μm Nickel gold deposit 表面准备：浸金 金属单面/双面：双面 镀铜通孔：是的阻焊：是的...
quality ceramic pcb board for led lighting
基板类型：氧化铝陶瓷基板材料厚度：0.5mm导电层：Cu金属层厚度：35mm / 35mm表面处理：重银金属单面/双面：双面镀铜通孔：是阻焊层：是 1。.精度高，电热性能好，插入强度高。 2。焊接性好，可实现盲孔通孔。 3。技术成熟，环保，无污染，成本低于传统技术。 4。应用范围广。 5。定制生产，无需开模，生产周期短。...
high power led cob ceramic substrate
表面镀层：表面镀层镀镍陶瓷镀层材料：65mm：层铜金属层厚度：75mm/75mm表面：浸金单/双面：双面镀铜通孔：阻焊层：否...
high power led cob ceramic substrate
1..精高，电热性能好，补充强度高。2。焊接性好，可实现盲孔通孔。3。技术完善，环保，无污染，成本训练培训技术。4。应用范围广，可5 。定制生产，无需开模，生产周期短。...
high heat disipation performance ceramic pcb
基板类型：氮化铝陶瓷基板材料厚度：0.65mm导电层：Cu金属层厚度：75mm / 75mm表面处理：浸金单面/双面：双面镀铜通孔：是阻焊层：否 1。.精度高，电热性能好，插入强度高。2。焊接性好，可实现盲孔通孔。3。技术成熟，环保，无污染，成本低于传统技术。4。应用范围广，可5。定制生产，无需开模，生产周期短。...
high conductivity ceramic aluminum copper clad pcb
合金镀层：陶瓷制造工艺材料厚度：0.635mm导电层：Cu，Ni，Au金属层厚度：300um 表面处理：浸金单面/双面金属：单镀铜通孔：否焊焊层：否 1..精高，电热性能好，补充强度高。2。焊接性好，可实现盲孔通孔。3。技术成熟，环保，无污染，成本训练传统技术。4。应用范围广，可5。定制生产，无需开模，生产周期短。...
high conductivity ceramic aluminum copper clad pcb
基板类型：氧化铝陶瓷基板材料厚度：0.635mm导电层：Cu，Ni，Au金属层厚度：300um表面处理：浸金单面/双面金属：单面镀铜通孔：否阻焊层：否 1。.精度高，电热性能好，插入强度高。2。焊接性好，可实现盲孔通孔。3。技术成熟，环保，无污染，成本低于传统技术。4。应用范围广，可5。定制生产，无需开模，生产周期短。...
5 technical articles »
Several ceramic materials are commonly used for the ceramic PCB
May 10, 2023 | 斯利通
Several ceramic materials are commonly used for the ceramic PCB...
Several ceramic materials are commonly used for the ceramic PCB
May 10, 2023 | 斯利通
Several ceramic materials are commonly used for the ceramic PCB...
Zirconia ceramic PCB, for applications in the field of microwave communication
May 10, 2023 | 斯利通
Zirconia ceramic PCB, for applications in the field of microwave communication...
The role that sapphire ceramic PCB play in MEMSdevices
May 10, 2023 | 斯利通
DPC (DirectPlatingCopper) thin film process is a method of prepare copper film using magnetron sputtering technology. This process is a process in which the copper target with the target material is placed in a true cavity chamber, and plasma is generated on the copper target surface by magnetron sputtering technology. The ions in the plasma are bombarded on the surface of the target, which is sputtered into fine particles and deposited on the substrate to form a copper film....
