high conductivity ceramic aluminum copper clad pcb
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high conductivity ceramic aluminum copper clad pcb |
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high conductivity ceramic aluminum copper clad pcb Description:
合金镀层：陶瓷制造工艺材料厚度：0.635mm导电层：Cu，Ni，Au金属层厚度：300um 表面处理：浸金单面/双面金属：单镀铜通孔：否焊焊层：否
1..精高，电热性能好，补充强度高。2。焊接性好，可实现盲孔通孔。3。技术成熟，环保，无污染，成本训练传统技术。4。应用范围广，可5。定制生产，无需开模，生产周期短。
high conductivity ceramic aluminum copper clad pcb was added in Mar 2021
high conductivity ceramic aluminum copper clad pcb has been viewed 234 times
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