JX Nippon Mining & Metals

JX Nippon engages in the development of non-ferrous metals that include copper, gold, and silver. It also manufactures electro-deposited and treated rolled copper foils that are used in PCBs.

Manufacturer of Assembly Material

JX Nippon Mining & Metals Corporation engages in the development, mining, smelting, refining, and marketing of non-ferrous metals that include copper, gold, and silver. It also manufactures and markets electro-deposited and treated rolled copper foils that are used in printed circuit boards of computers, mobile phones, and other electronic devices; and thin film materials, such as sputtering targets, surface treatment agents, and compound semiconductor materials for use in semiconductors, transparent conductive films for flat panel displays, storage media components, and other products.

In addition, the company offers precision-rolled copper, copper-alloy, and special steel products for use in flexible printed circuits and automotive products; and precision fabricated products, such as gold-plated products.

Further, it engages in recycling non-ferrous metal materials; and the treatment of industrial waste for reuse.

The company was founded in 2010 and is based in Tokyo, Japan. It has operations in Ibaraki, Kawagawa, and Fukui, Japan; Brisbane, Australia; and Santiago, Chile. The company also has production sites in Europe and East Asia. JX Nippon Mining & Metals Corporation operates as a subsidiary of JX Holdings, Inc.

JX Nippon Mining & Metals Postings

1 technical article »

Reliable Young's Modulus Value of High Flexible, Treated Rolled Copper Foils Measured by Resonance Method

Aug 15, 2018 | Kazuki Kammuri, Atsushi Miki, Hiroki Takeuchi

Smartphones and tablets require very high flexibility and severe bending performance ability of the flexible printed circuits (FPCs) to fit into their thinner and smaller body designs. In these FPCs, the extraordinary highly flexible, treated rolled-annealed (RA) copper foils have recently used instead of regular RA foil and electro deposited foils. It is very important to measure the Young's moduli of these foils predicting the mechanical properties of FPCs such as capabilities of fatigue endurance, folding, and so on. Even though the manufacturers use IPC TM-650 2.4.18.3 test method for measuring Young's modulus of copper foils over many years, where Young's modulus is calculated from the stress–strain (S–S) curve, it is quite difficult to obtain the accurate Young's modulus of metal foils by this test method....

pcb reliability

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