Iphone 6 motherboard reballing station Semi automatic bga rework station machine to desolder and solder chip on mobile pcb
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Iphone 6 motherboard reballing station Semi automatic bga rework station machine to desolder and solder chip on mobile pcb |
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Iphone 6 motherboard reballing station Semi automatic bga rework station machine to desolder and solder chip on mobile pcb Description:
Semi automatic bga rework station machine to desolder and solder chip on mobile pcb
Features:
1. Made of quality heating material;desoldering and solding procedures of BGA are precisely controlled;
2. Movable heating head,which can be moved freely horizontally; easy to be operated;
The temperature of the upper and bottom are hot air and large botton IR heater area , three temperature heating zones and left temperature-control settings make the rework safer and more reliable .
3. The temperature of the upper and lower hot air guns can be precisely controlled according to their specifictemperature, the infrared constant temperature heating zone at the lower part and the appropriate temperature-control settings make the rework safer and more reliable .
4. Embedded industrial computer,Touch screen interface,PLC control,real-time temperature curve display, be able to display temperature curves and detecting curves at the same time;
5. Powerful cross flow fans cool the bottom heating area rapidly.
6.Equipped with different hot air nozzles,easy to replace and 360°rotation in any angle.
7. The adjustable PCB positioning support,onto which the special fixtures for allotype board could be installed, enables easy and fast positioning of the PCB board .
8. The supports for the BGA soldering supporting frame are mirco-adjustable to restrain local sinkage;
9.8 segments of temperature control,200 groups of temperature curve are stored,Curve analysis can be carried out on the touchscreen.
10.Both the upper and bottom parts are equipped with over temperature alarming and protection apparatus.
11. Buzz after solding is finished or desoldering;hand vacuum pen is adjustable for removing BGA;
12.The integrated design of machine and chassis is room-saving.could be altered to instrument-control.
13.With different alloy hot gas nozzles,easy to replace, it could be tailored as per the specific requirements.
Technical parameter:
PCB size |
W20*D20~W450*D400 |
PCB thickness |
0.5~4mm |
Temperature control |
K-type thermocouple,close cycle controlled |
PCB locating way |
Jig |
Bottom IR preheat |
Far infrared 2700w |
Top heater |
Hot air 1000w |
Bottom heater |
Hot air 1000w |
Power supply |
Single phase 220V,50/60Hz, |
Machine dimension |
L660*W630*H600mm |
Weight |
Approx. :60kg |
Details:
Company Information
Shenzhen Honreal Technology Co.,Ltdis a national high-tech enterprise,Specializing in smt equipment research and development, production, sales. Services for the world´s top 500 electronic companies.The registered capital of the company is 5 million.Havingexperienced technical team andexcellent technical innovation ability, Creating a better product supply chain and service team and meeting differentcustomer needs is our long-term goal. We will meet customer needs by understanding customers, putting them first and providing valuable services.
Certification
Contact Us
Company | Shenzhen Honreal Technology CO.,Ltd. |
Address | No15,Shangnan Hongma Road, Shajing Street, Baoan District, Shenzhen, Guangdong Province, China |
Tel | +86755 2302 0279 |
Fax | +86 755 2330 6782 |
Zip code | 518125 |
Skype/Whatsapp/Wechat | +8613715227009 |
Email: | Monica@szhonreal.com |
Website | www.machinesmt.com |
Iphone 6 motherboard reballing station Semi automatic bga rework station machine to desolder and solder chip on mobile pcb was added in Jan 2019
Iphone 6 motherboard reballing station Semi automatic bga rework station machine to desolder and solder chip on mobile pcb has been viewed 560 times
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