Beihang University

Beihang University, previously known as Beijing University of Aeronautics and Astronautics is a major public research university located in Beijing, China, emphasizing engineering, technology, and the hard sciences.


Beihang University was founded on October 25, 1952 under the name of Beijing Institute of Aeronautics, originating from the merger of the aeronautical departments of Tsinghua University, Beiyang University, Xiamen University, Sichuan University, etc.

Located in the center of the Zhongguancun Science Park and within easy reach of central Beijing, Beihang is the first university in China focusing on aeronautical and astronautical education and research. About 26km away from the main campus, the suburban Shahe campus provides quiet study milieu and is also home to the National Laboratory of Aeronautics and Astronautics (NLAA). The very new Doudian campus aims at research and innovation through engineering combined with medicine.

Beihang University Postings

1 technical article »

A Life Prediction Model of Multilayered PTH Based on Fatigue Mechanism

Dec 26, 2019 | Yaqiu Li, Weiwei Hu, Yufeng Sun, Zili Wang, Ali Mosleh

Plated through hole (PTH) plays a critical role in printed circuit board (PCB) reliability. Thermal fatigue deformation of the PTH material is regarded as the primary factor affecting the lifetime of electrical devices. Numerous research efforts have focused on the failure mechanism model of PTH. However, most of the existing models were based on the one-dimensional structure hypothesis without taking the multilayered structure and external pad into consideration.</p><p>In this paper, the constitutive relation of multilayered PTH is developed to establish the stress equation, and finite element analysis (FEA) is performed to locate the maximum stress and simulate the influence of the material properties. Finally, thermal cycle tests are conducted to verify the accuracy of the life prediction results. This model could be used in fatigue failure portable diagnosis and for life prediction of multilayered PCB....

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