Hydro-clean LDS-S

Hydro-clean LDS-S Description:

Cleaning Application

Removing all kinds of solder residues
Cleaning of micromechanical component
Removing contamination from handling and board manufacturing ,FOD
Cleaning highly populated electronic assemblies with low standoff, such as :FC,BGA,CSP,BTC,QFN,MELF
Cleaning power component
Cleaning sensitive electronic component
One side misprints on complex assembly 
Cleaning before conformal   coating and wire bonding

Unique Advantage:

Fully automatic spray-in-air closed loop zero drain system
Linear direct spray achieve significant cleaning effect
100% filtration of entire DI water
Optional double  rinse
Hot air knife direct dry technology
Glass door  for observing  cleaning process
Wide range of standard and customized PCBA fixtures
Clamping for all types of stencils
Fully isolated pipeline ensure cleaning effection.
Low consumption of chemicals and water
Proportional level sensors in all processes
Outstanding options of water utilization