Flextronics International

Flex Ltd. is an American Singaporean-domiciled multinational electronics contract manufacturer. It is the third-largest global electronics manufacturing services, original design manufacturer company by revenue, behind only ...

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1 technical article »

Low Temperature SMT Solder Evaluation

Sep 23, 2020 | Howard "Rusty" Osgood, David Geiger, Robert Pennings, Christian Biederman, Jie Jiang, Jon Bernal

The electronics industry could benefit greatly from using a reliable, manufacturable, reduced temperature, SMT solder material (alloy-composition) which is cost competitive with traditional Sn3Ag0.5Cu (SAC305) solder. The many possible advantages and some disadvantages / challenges are discussed. Until recently, the use of Sn/Bi based materials has been investigated with negative consequences for high strain rate (drop-shock) applications and thus, these alloys have been avoided. Recent advances in alloy "doping" have opened the door to revisit Sn/Bi alloys as a possible alternative to SAC-305 for many applications. We tested the manufacturability and reliability of three low-temperature and one SAC-305 (used as a control) solder paste materials. Two of these materials are doped Sn/Bi/Ag and one is just Sn/Bi/Ag1%. We will discuss the tests and related results. And lastly, we will discuss the prospects, applications and possible implications (based on this evaluation) of these materials together with future actions....

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