MiTAC International Corporation

MiTAC Holdings Group has been developing into a multinational organization of JDM / ODM / OEM / OPM (Original Product Manufacture), design and R&D, manufacturing, testing, assembling, marketing, and servicing in around four decade

OEM

MiTAC International Corporation Postings

1 technical article »

Interconnect Reliability Correlation with System Design and Transportation Stress

Oct 18, 2020 | Dr. Paul Wang, Vincent Weng, and Dr. Kim Sang Chim

Interconnect reliability especially in BGA solder joints and compliant pins are subjected to design parameters which are very critical to ensure product performance at pre-defined shipping condition and user environment. Plating thickness of compliant pin and damping mechanism of electronic system design are key successful factors for this purpose. In additional transportation and material handling process of a computer server system will be affected by shock under certain conditions. Many accessories devices in the server computer system tend to become loose resulting in poor contact or solder intermittent interconnect problems due to the shock load from the transportation and material handling processes....

Voidless Reflow Soldering

Vortik dispensing systems 1k and 2k solutions - Nordson Asymtek