High Frequency PCB

High Frequency PCB Description:

High Frequency PCB

Material: SYTECH

Layer Count: 4 layers

PCB Thickness: 1.6mm

Min. Trace / Space Outer: 0.1mm/0.1mm

Min. Drilled Hole: 0.2mm

Via Process: Tenting Vias

Surface Finish: ENIG+OSP

Product Features

1. DK needs to be tiny as well as steady sufficient, typically the smaller sized the much better, high DK might cause signify transmission hold-up.
2. DF ought to be little, which mostly influences the top quality of signal transmission, the smaller sized DF might make smaller sized signal waste as necessary.
3. The thermal expansivity ought to coincide with copper aluminum foil as long as feasible, due to the fact that the distinction will certainly result in copper aluminum foil divided in the modifications of cool and also warm.
4. Water absorptivity has to be reduced, high water absorptivity will certainly influence DK as well as DF when in the damp atmosphere.
5. Warm standing up to the residential or commercial property, chemistry withstanding, influence endurance, remove standing up to need to be excellent.

High-Frequency PCB Material demands:

1. Adjusted permittivity.
2. Reduced depletion for reliable signal transmission.
3. Uniform building and construction with reduced resistances in insulation density as well as dielectric continuous.