Inline UV PCB Laser Depaneling Machine

Inline UV PCB Laser Depaneling Machine Description:

Inline UV PCB Laser Depaneling Machine 

Inline UV PCB Laser Depaneling Instruction:

PCB depaneling and singulation laser systems are gaining popularity—especially as circuit board complexity and component ratios continue to rise. Microelectronics and medical device manufacturers require close tolerances and minimal debris—this is where laser technology shines

Inline UV PCB Laser Depaneling Machine Performance:

1.Dimension:1600mmx1500mmx1800mm(LxWxH)

2. Capacity UPH: single head 1.5-2.0K(according to sample testing)

3. Repeat accuracy:±0.003mm

4. CCD accuracy:±0.005mm

5. Laser head:UV15W

6. Cutting precision:+/-0.03mm

7.Cutting yield:FR4 99.9%

8. Operator:1 person

9. Track height:950mm±100(could be customized made)

10. Power supply:220V/15A/50Hz,0.5-0.7Mpa

Inline UV PCB Laser Depaneling Specification:

PCB Feeding and Loading:

1. Use magazine lifting mechanism + X-Z manipulator + fixture plate grasping mechanism to realize automatic feeding

2. The motor manipulator is used to realize the back and forth movement, and the product grasping function is realized by the electric Z axis and the mechanical claw function. Set waste collection area at the same time to realize automatic separation of single PCBA and waste

3. The loading mechanism of the gripper of the loading robot adopts a dual-station mode to realize the synchronous operation of the upper and lower fixture plates and improve the production efficiency.

Waste PCB Removal:

1. The rotary cylinder is used to realize 90-degree back and forth movement, and the vacuum is used to suck the waste frame to realize the function of separating the automatic waste and the base plate.

2. Adopt upper and lower cylinders and vacuum sucker mechanism to achieve accurate grasping of waste frame.

3. The bin is equipped with a radio fiber, which realizes the automatic reminder function of full waste.