SMT Equipment

UV Laser PCB Depaneling System, Dual Table for High Volume

Company Information:

Manufacturer of PCB depaneling and PCB soldering machines since 2005, products include CE approval V-groove PCB depanelizer, PCB router, PCB punching machine, laser depaneling, hot bar soldering machines and soldering robots.

Huizhou, China

Manufacturer

  • Phone +86-138-29839112

See Website »

Company Postings:

(27) products in the catalog

(1) technical library article

UV Laser PCB Depaneling System, Dual Table for High Volume

UV Laser PCB Depaneling System, Dual Table for High Volume

Name:

UV Laser PCB Depaneling System, Dual Table for High Volume

Category:

Depaneling

Offered by:

Winsmart Electronic Co.,Ltd

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UV Laser PCB Depaneling System, Dual Table for High Volume Description:

UV Laser Depaneling System

UV Laser PCB Depaneling System, Dual Table for High Volume

Laser Depaneling Purpose:

The processing and application objects are PCB, FPC soft and hard plate and related material cutting, cover opening and other operations.

Efficient integration of all components of the equipment, including laser, optical path, galvanometer system, 4-axis motion platform and image

System to achieve efficient and accurate operation.

Laser Depaneling Specifications:

Power 380V AC, 50Hz, 20A
Compressed Air Compressed air
Machine Dimension 1450(L)x1350(W)x1665(H)mm
Installation Space 3000x3000x2500mm
Machine Weight 2000kgs
Ambient Temperature 22 ~ 25 ℃
temperature variation within ± 1 ℃ / 24hr
ambient humidity within 40% ~ 70% (no obvious condensation is allowed)
Dust free grade 100000 or better
power consumption 6KW
Cutting width ≤ 50mm × 50mm
Cutting materials full cut / half cut of PCB / FPC, LCP / glue and other related materials
Cutting thickness ≤ 3mm
Cutting speed ≤ 3000mm / S
Overall machining accuracy ≤ 30um
Processing pattern straight line, slash, curve, abnormity, etc

Laser Depaneling Laser Source:

Laser 355nm light wave nanosecond laser
Repetition frequency 50-150khz
Laser Powe UV 15W@30KHz
Pulse width < 20ns
Energy stability < 3% RMS over 8hours
Beam quality m ² < 1.3
Mode 2500mm/S

Laser Depaneling Features:

Effectively control the processing heat effect, and improve the edge collapse and thermal effect of the product. High quality laser, no contact processing, no burr and burr after cutting. Mature process system can accurately calculate and segment the graphics, and realize the process of processing parameters and processing graphics. No stress, ±5μm cutting precision. Import gerber file for easy operation. Alien/line cutting is available. Non-contact, smooth cutting edge.

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UV Laser PCB Depaneling System, Dual Table for High Volume was added in May 2022

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