Printed Circuit Board Assemblies

Printed Circuit Board Assemblies Description:

Printed Circuit Board Assemblies

Valuetronics has experience in many methods of printed circuit board assembly from through hole and mixed technology to customized fine pitched surface mount technologies.

Our process capabilities include:

• 01005 chips
• 0.4mm fine pitch IC
• Flip Chip
• CSPs
• BGAs and Micro-BGAs
• PoP (0.4mm pitch package on package)
• 3D Solder Paste Inspection (SPI)
• In-Circuit Test (ICT)
• Automatic Optical Inspection (AOI)
• X-Ray Inspection

Our equipments include:

• 25 SMT lines (more than 50 millions chips placement/day)
• Lead Free Reflow ovens
• Lead Free Dual Wave machines
• Lead Free Selective Soldering machines
• Bonding machines

Valuetronics comprehensive manufacturing capabilities enable us to accommodate our customers’ requirements for volume, mix and complexity. We excel in a variety of volume requirements from low-volume complex custom products to high–volume standards products.

Our highly trained and skilled personnel can offer manufacturing capabilities for a wide range of printed circuit boards, electro-mechanical and box-build assemblies. These capabilities include:

• Plastic Tool Fabrication and Injection Molding
• Printed Circuit Board Assemblies, including complex multi layer boards
• Sub-Assemblies and Full Product Assemblies (Box Build) across a wide variety of segments
• Reliability Engineering and Testing
• Quality Systems
• Materials Procurement
• On-site Program Management