Dear All,
I have OSP finsh pcb on my production, the pcb thickness is 1.5mm and the product is one sideded pcba.
After reflow process, Is there any specific time frame defined for smt completed OSP finish pcba before going for wave soldering process.
flux used: ALPHA® EF-6808HF
we have set various parameters, In each day we are solving the issue, but cannot able to maintain a constant parameter settings for this product.
Currently we are facing insufficient solder at many regions.
Can anyone help on this issue.
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