Defining the thickness of solder between the lead and the pad, J-001 states "Properly wetted fillet shall be evident." J-001 is available from http://www.ipc.org.
Factors that affect this are: * Amount and composition of solder * Amount and composition of flux * Lead shape, solderability protection, and solderability * Pad flatness, solderability protection, and solderability * Component weight * Reflow profile
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