What are the ways of placing underfill material under the flip chip.I read about dispensing from one side and dispensing from 2 sides. There must be other ways and I suppose some of you know them.I will appreciate any knowledge on the subject. Thank you!
Depends on your Material (Chemistry) and Machine. We use a hot plate with the material in an "L" patern. The Hot plate is used only in aiding the capillary action. Also, is time an issue??