Hello, I am currently trying to isolate internal fallout problems with very low yield substrates mixed with great yields and have recently found that we are using a Sn62/Pb36/Ag2 solder paste with full tin (no lead) components as well as Pb95/Sn5 solder components. Could this cause reflow problems in production? I would think that the three different temperature ranges could pose an issue, but I don't know for sure how they would be affected. Thanks! -Ryan
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