Stencil printing equipment has traditionally been used in the surface mount assembly industry for solder paste printing. In recent years the flexibility of the tool has been exploited for a wide range of materials and processes to aid semiconductor packaging and assembly. One such application has been the depsoition of adhesive coatings onto the backside of silicon wafers.
This paper looks at the application of two totally different epoxy materials to the non active side of silicon wafers – one providing a B-stageble die attach layer and one providing a protective laser-markable cover layer aimed at protecting individual die from damage during dicing.
Credit / Source: Mark Whitmore, Jeff Schake DEK
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MV-7 Series
In-Line AOI Machine
Designed to automatically inspect for manufacturing defects both pre and post reflow. In-line capability for increased throughput... »»
Offered by: Mirtec
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Auto-Dip 2100T
Soldering System
Fast, efficient, and reliable alternative to manual lead-free soldering. Large 490 mm x 320 mm (19.3" x 12.6") work area... »»
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ProntoTEST-FIXTURE
ATE, MDA Software. Download Trial
Programs ATE MDA, and flying probe test equipment and design the "Bed of Nails" test fixtures... »»
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Electronics Manufacturing Exchange #113 hosted by Honeywell
GoIndustry DoveBid
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Accutronics Contract Manufacturing
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BOM - what software or system you use?
Posted by leadthree
I am interested to learn what software you use to handle BOMs. So far we just use static Excel sheets, so different BOMs are not connected. I wonder what other companies use. I was looking into some GPL licensed (means free) packages, but most are ERP with a BOM function, which is a bit over the top... »»
Immersion SIlver PCB --> Creeping Corrosion
Posted by Sean
I have few questions about creeping corrosion that potentially happen on lead free immersion silver PCB as below: 1) What test that we can conducted to verify whether the failure we seen is due to creeping corrosion?... »»
Wave Direction/Package help
Posted by BACON: the candy of meats
I need some clarification. Our company is working with a start up company on some prototypes. On the bottom of the assembly they are placing a SOT23-5 component. It is being presented to the wave so the lead banks are parallel to the wave... »»
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Wed, September 16, 2009 | Metropolitan Exposition Center, Portland, OR, USA
America's largest and longest running contract manufacturing shows for the sourcing of custom parts, services and design. Regional tradeshows covering the USA provide OEMs the opportunity to meet local and national job shops... »»
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Thu, September 17 | Best Western Alpenglo Lodge & Conference Center, Portland, Winter Park, CO, USA
"Bridging The Gap" between Design Engineering and Operations by exceptional Configuration Management. Sets the stage for innovation. Basics and more about engineering releases, bills of material, requesting changes and making changes... »»
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