SMT Express, Volume 2, Issue No. 12 - from SMTnet.com
Volume 2, Issue No. 12
Friday, December 15, 2000
SMTnet's OnBoard Forum to Feature Charles Harper
December 18, 2000 8:00 AM EST to December 20, 2000 5:00 PM EST
Charles A Harper is the editor of High Performance Printed Circuit Boards, published by McGraw-Hill. Mr. Harper is president of Technology Seminars, Inc., of Lutherville, Maryland, and is widely recognized as one of the leaders in the electronic packaging industry. He has authored over a dozen well known books in the field and is among the founders and past presidents of the International Microelectronics and Packaging Society. He is also Series Editor for the McGraw-Hill Electronic Packaging and Interconnection Series. Mr. Harper is a graduate of The Johns Hopkins School of Engineering, where he also served as Adjunct Professor. He worked as a practicing engineer for Westinghouse Electric Corporation, where he acted as manager of Electronic Packaging and Materials Technologies.
One of the biggest mistakes I see companies making right now is putting money into developing a web-site, and then not including it in the overall marketing plan. These "orphan" web-sites are often left to fend for themselves, judged harshly for 'not producing' while given no support from existing marketing efforts.
The most effective web-sites are the ones that are being integrated into a complete marketing plan and...
Assemblers have used thick films to add features to substrates since the 1940s, some thirty years before the advent of the etched copper traces used on the majority boards today. The difference between thick and thin film circuits is the method of applying the film, rather than the thickness of the film. Thick film processes are involve screening, which is very similar to the stenciling process used in surface mount technology. Further, many components, placement processes, paste firing, and cleaning process are similar between...
Organic material and ceramic substrates are the foundation to which almost all components are attached. The level of complexity in sophisticated microelectronics and circuit designs place great performance demands on conventional board technologies. In "High Performance Printed Circuit Boards", Charles A. Harper brings together a team of specialists to provide data and design information for a new generation of...
Why APEX? by by Robert J. Black & Ken Cavallaro, Juki Automation Systems
Reprinted, with permission, from Surface Mount Technology, October 2000 (Volume 14, Issue 10)
The Assembly Process Exhibition and Conference (APEX), a new electronic production equipment and process show, was introduced on March 14, 2000. APEX, produced by the Surface Mount Equipment Manufacturers' Association (SMEMA) Council of the IPC - Association Connecting Electronics Industries, sold out all exhibit space and drew attendees worldwide. The crowded aisles and well-attended technical conference were strong evidence of the inaugural show's success. But why was APEX necessary? Why does it meet the industry's needs better than...
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