Printer-hosted processes for solder ball placement are now widely used for package technologies ranging from BGAs using ball diameters above 750µm to the latest WL-CSPs demanding 250µm diameter. This broadening spectrum of applications brings more choices in terms of stencil design rules and production methodologies.
Credit/Source: DEK, Steve Watkin, Tom Falcon
Digital oscilloscopes, spectrum, logic and network analyzers, generators, meters, counters, plug-ins, test sets, cards and much more.
BEST Instructors have put to video demonstrations of common hand soldering skills. These are not designed to be in place of live one on one training where repetitive skills and subsequent one on one feedback is given. Rather they are quick refreshers designed to be viewed if a specific skill has not been practiced in a while.
More Equipment Listings:
Posted by SWAG
We just got a contract to build a board with 1400+ SMT placements. This thing is 16" x 12" and the PCB thickness is 0.142"...»»
Posted by mpolak
Could you guys verify my BTU VIP98N oven settings for lead free process. At the moment as my standard profile im using these settings... »»
Posted by ehess
Does anyone kbnow where I can find replacement belts for the old PCT (Process control Technologies) conveyors?... »»
More Forum Topics:
Seminar/Course | Precision PCB Services, Inc
Mon, January 07, 2008 | Oroville, CA, USA
In this two day course students will learn how to repair surface mount pads, BGA pads, finger contacts, traces, laminate... »»
Conference | Heller Industries Inc.
Thu, January 17, 2008 | Online
Success Starts with the Right Profile. Join the leader in oven technology for the latest in thermal profiling information... »»
Trade Show/Exhibition | Reed Exhibitions Japan Ltd.
Wed, January 16, 2008 | Tokyo Big Sight, Tokyo, Japan
Exhibition Featuring all Lines of Test, Inspection and Measurement Systems for SMT, IC Packaging and Board Manufacturing... »»
Buffalo Grove, IL, USA
Responsible to support sales and technical activities to maintain and acquire business with assigned accounts. Administrative support regarding account contracts...»»
Neenah, WI, USA
Responsible for providing technical support and training on all factory/site assembly production equipment. Individual may lead, train, and mentor lower level technicians...»»
Pullman, WA, USA
The ideal candidate will be able to assist management to specify, evaluate, recommend and conduct acceptance tests on electronic assembly process equipment...»»
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