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Impact of Reflowing A Pb-free Solder Alloy Using A Tin/Lead Solder Alloy Reflow Profile On Solder Joint Integrity

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Featured Article

The Impact of Reflowing A Pb-free Solder Alloy Using A Tin/Lead Solder Alloy Reflow Profile On Solder Joint Integrity.

The electronics industry is undergoing a materials evolution due to the pending Restriction of Hazardous Substances (RoHS) European Directive. Printed wiring board laminate suppliers, component fabricators, and printed wiring assembly operations are engaged in a multitude of investigations to determine what leadfree (Pbfree) material choices best fit their needs. The size and complexity of Pbfree implementation insures a transition period in which Pbfree and tin/lead solder finishes will be present on printed wiring assemblies(...)

The objective of the study was to evaluate the solder joint integrity impact of reflowing a Pbfree solder alloy using a tin/lead reflow profile on BGA components.

Credit/Source: David Hillman, Matt Wells, Kim Cho Rockwell Collins

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