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Advanced Thermal Interface Materials for Enhanced Flip Chip BGA
SMTnet - Electronic Industry Hub

Advanced Thermal Interface Materials for Enhanced Flip Chip BGA

A simplified presentation of Flip-Chip Ball Grid Array.Increased functionality and performance requirements for microprocessors and ASICs have resulted in a trend to package these devices in the flip-chip BGA form factor (FCBGA). Because these devices use in excess of 40-100 Watts of power, their packages must dissipate heat in an extremely efficient manner.

Most semiconductor companies have developed some type of thermally enhanced FCBGA package that provides heat dissipation through the back of the die to a heat spreader. This design works very well, but is highly dependent on the ability of the thermal interface material (TIM) to transfer thermal energy efficiently from the back of the die to the heat spreader. The TIM is often the limiting factor for heat dissipation, either because it does not conduct heat adequately, or because it fails to maintain intimate contact between the back side of the die and the heat spreader.

Credit / Source: Punit Kohli, Martin Sobczak, Jeff Bowin, Michael Matthews Henkel / Ablestik Laboratories

Read Article...

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Featured auction

Electronic Manufacturing Exchange #120

Date: 19 Jan | GoIndustry DoveBid

Location of Assets: Various locations

Hundreds of Pieces of Manufacturing and Test Equipment used in the Semiconductor, Surface Mount, PCB, Fiber Optic, Disk Drive and Electronic Manufacturing Industries.

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Via Failure in Field | Posted by oddbudman

We have recently had some products returned (they were installed and operating in the field for around 2 months before they were returned). After looking at the boards it seems the vias have failed... »»

Soldering to Chrome plated pads | Posted by SteveO

Is it possible to reflow leaded or lead-free solder paste onto chrome plated pads?... »»

High Melting Point Solder Paste | Posted by leeg

Has anyone had any experience of using High Melting Point Solder paste in production. We have started to trial some boards using the Solder Paste and are experiencing poor solder joints and solder joints that look grainy... »»

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Matrix Tray Setup...

A bit off-topic - pin cutting...

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Southern Electronics 2010

Trade Show / Exhibition | Wed, February 10 | Sponsored by: ETES European Trade & Exhibition Services Ltd

Southern Electronics provides the first and best opportunity for professionals in the UK electronics industry to source new services, components, technology and equipment in 2010... »»

Shock and Drop Testing of Electronic Assemblies

Seminar/Course | Tue, February 16 | Sponsored by: CALCE

Abhijit Dasgupta conducts his research on the mechanics of engineered, heterogeneous, active materials, with special emphasis on the micromechanics of constitutive and damage behavior... »»

INTERNEPCON JAPAN - ASIA'S LARGEST Exhibition for Electronics Manufacturing and SMT

Trade Show / Exhibition | Wed, January 20 | Sponsored by: Reed Exhibitions Japan Ltd

Asia's largest exhibition which showcases equipment, materials and technologies needed to manufacture SMT and electronic products.... »»

Career Center


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AAT is looking for a representative organization with complementary lines of capital equipment... »»

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Industry Associations Events


SMTA - Surface Mount Technology Association is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies. Membership Info | SMTA International | Bookstore

Next Event: LA/OC SMTA Chapter Training - Lean & Green by Phil Zarrow - January 21


IPC - Association Connecting Electronics Industries is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly. Membership Info | Training & Certification Programs | Standards & Publications - Online Store

Next Event: Introduction to EMS Training and Program Management - January 15 - 16

SMTnet Express
January 7, 2010

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Go-Dove Electronic Equipment Auctions

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