Thermal Spot Curing of Adhesives with Photonic Energy; a novel fiber delivery method of radiant heating to accelerate the polymerization of thermally active adhesives
A novel fiber delivery method of radiant heating to accelerate the polymerization of thermally active adhesives
This paper reviews the use of adhesives, the types of heat curing assembly adhesives that are commonly used in microelectronics, and goes through some simple case studies of spot curing using radiant energy with an innovative fiber light guide spot curing system.
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