Creep corrosion normally happens in the end system, PCB, connectors and components are widely noted due to the exposure of high sulfur environments under elevated humidity. In this study, the major focus is the investigation of PCBs with 3 different types of surface finish (ImAg, Post-Treatment ImAg, HT-OSP), SMD vs NSMD and non clean organic acid flux residue from simulating wave soldering process under MFG Test (Mixed Flowing Gas Test). The realistic mixed flowing gas (H2S, SO2, NO2, Cl2) at certain concentration of each and relative humidity are designed to accelerate creep corrosion happening.
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