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Thermal Characteristics of PCB Laminates used in High Frequency Applications

SMTnet Express July 11, 2012, Subscribers: 25312, Members: Companies: 8920, Users: 33335

Thermal Characteristics of PCB Laminates used in High Frequency Applications

First published in the 2012 IPC APEX EXPO technical conference proceedings.

by: John Coonrod; Rogers Corporation, Advanced Circuit Materials Division

As technology advances, understanding thermal management issues of high frequency PCB�s increases. There are many different aspects to consider for PCB thermal management. This paper will investigate thermal management issues of high frequency PCB�s as it relates to material properties, insertion loss and circuit design configurations. It will be shown that there are many tradeoffs between these aspects which can be very beneficial for the circuit designer to be aware of.

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