The physical mechanisms behind tin whisker formation in pure tin (Sn) films continue to elude the microelectronics industry. Despite modest advances in whisker mitigation techniques (i.e., barrier metal underlayers, substrate/film annealing, etc.) and encapsulation, ways to fundamentally prevent whiskers from forming remain unknown. It has been said that tin plating thicknesses of <0.5 um or >20um are "whisker inhibiting"[3,6] (...)
Our work examines the effect of adding grain refiners during tin electroplating, with particular focus on the �as-deposited� film morphology and the associated incidence of whiskering.
SMTA - Surface Mount Technology Association is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies. Membership Info | SMTA Certification | Bookstore