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Effects of Tin and Copper Nanotexturization on Tin Whisker Formation

SMTnet Express August 17, 2012, Subscribers: 25395, Members: Companies: 8952, Users: 33485

Technical Library

Effects of Tin and Copper Nanotexturization on Tin Whisker Formation

First published in the 2012 IPC APEX EXPO technical conference proceedings.

by: David M. Lee, Lesly A. Piñol, PhD; Johns Hopkins Applied Physics Laboratory

The physical mechanisms behind tin whisker formation in pure tin (Sn) films continue to elude the microelectronics industry. Despite modest advances in whisker mitigation techniques (i.e., barrier metal underlayers, substrate/film annealing, etc.) and encapsulation, ways to fundamentally prevent whiskers from forming remain unknown. It has been said that tin plating thicknesses of <0.5 um or >20um are "whisker inhibiting"[3,6] (...)

Our work examines the effect of adding grain refiners during tin electroplating, with particular focus on the �as-deposited� film morphology and the associated incidence of whiskering.

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NEPCON South China 2012 | August 28, Shenzhen, China | Reed Exhibitions

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IPC Midwest Conference & Exhibition | August 22, Schaumburg, IL, USA | IPC

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Next Event: SMTA Webtorial Counterfeit Electronics - Risks and Mitigation - August 14-21


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Next Event: EMS Leadership Training and Certification Exam in conjunction with IPC Midwest� - August 18 - 19

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