Solder voiding in ball grid array (BGA) solder joints has been well characterized and documented in IPC-A-610 and IPC-7095 which define industry recommended BGA solder workmanship criteria and methods of inspection. Solder voiding limits associated with other, non-BGA, Surface Mount Technology (SMT) solder joint types however are neither well defined nor well understood in the industry (...)
This paper provides definitions of the different voiding types encountered in Gull Wing solder joint geometries. It further provides corresponding reliability data that support some level of inclusion voiding in these solder joints and identifies the final criteria being applied for certain IBM Server applications...
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Conference: Oct. 14 - 18, 2012
Exhibition: Oct. 16 - 17, 2012
Walt Disney World Dolphin Hotel
Don't miss the industry's strongest technical program and one of the premier capital equipment shows in North America. Get the latest research and training on today's hottest topics like Lead-Free (including military and space), Surface Finish, Reliability, 3D/Package on Package, BGAs and BTCs, Head in Pillow Defect, QFN and LGA Challenges and more. Register by September 14 to save 10% with the Early Bird discount. If this is your first time attending SMTAI, you automatically get an additional 10% off your conference registration.
Technical Conference (October 14-18) Early Bird Rate Expires Sept. 14
Over 130 papers presented by leading technologists
SMTA - Surface Mount Technology Association is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies. Membership Info | SMTA Certification | Bookstore