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Inclusion Voiding in Gull Wing Solder Joints

SMTnet Express August 30, 2012, Subscribers: 25432, Members: Companies: 8960, Users: 33565

Technical Library

Inclusion Voiding in Gull Wing Solder Joints

First published in the 2012 IPC APEX EXPO technical conference proceedings.

by: T.L. Lewis, C.O. Ndiaye, J.R. Wilcox; IBM Corporation

Solder voiding in ball grid array (BGA) solder joints has been well characterized and documented in IPC-A-610 and IPC-7095 which define industry recommended BGA solder workmanship criteria and methods of inspection. Solder voiding limits associated with other, non-BGA, Surface Mount Technology (SMT) solder joint types however are neither well defined nor well understood in the industry (...)

This paper provides definitions of the different voiding types encountered in Gull Wing solder joint geometries. It further provides corresponding reliability data that support some level of inclusion voiding in these solder joints and identifies the final criteria being applied for certain IBM Server applications...

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Forum search results for related keywords: Voiding, Gull wing, Solder, Component


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SMTA International

Conference: Oct. 14 - 18, 2012 

Exhibition: Oct. 16 - 17, 2012

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Don't miss the industry's strongest technical program and one of the premier capital equipment shows in North America.  Get the latest research and training on today's hottest topics like Lead-Free (including military and space), Surface Finish, Reliability, 3D/Package on Package, BGAs and BTCs, Head in Pillow Defect, QFN and LGA Challenges and more.  Register by September 14 to save 10% with the Early Bird discount.  If this is your first time attending SMTAI, you automatically get an additional 10% off your conference registration. 

 

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