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Inclusion Voiding in Gull Wing Solder Joints

SMTnet Express August 30, 2012, Subscribers: 25432, Members: Companies: 8960, Users: 33565

Inclusion Voiding in Gull Wing Solder Joints

First published in the 2012 IPC APEX EXPO technical conference proceedings.

by: T.L. Lewis, C.O. Ndiaye, J.R. Wilcox; IBM Corporation

Solder voiding in ball grid array (BGA) solder joints has been well characterized and documented in IPC-A-610 and IPC-7095 which define industry recommended BGA solder workmanship criteria and methods of inspection. Solder voiding limits associated with other, non-BGA, Surface Mount Technology (SMT) solder joint types however are neither well defined nor well understood in the industry (...)

This paper provides definitions of the different voiding types encountered in Gull Wing solder joint geometries. It further provides corresponding reliability data that support some level of inclusion voiding in these solder joints and identifies the final criteria being applied for certain IBM Server applications...

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