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Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission

SMTnet Express January 3, 2013, Subscribers: 26072, Members: Companies: 9076, Users: 34113

Investigation of Pad Cratering in Large Flip-Chip BGA using Acoustic Emission

by: Anurag Bansal, Cherif Guirguis, Kuo-Chuan Liu; Cisco Systems

Electronics assemblies with large flip-chip BGA packages can be prone to either pad cratering or brittle intermetallic (IMC) failures under excessive PCB bending. Pad cratering cracks are not detected by electrical testing or non-destructive inspection methods, yet they pose a long term reliability risk since the cracks may propagate under subsequent loads to cause electrical failure. Since the initiation of pad cratering does not result in an instantaneous electrical signature, detecting the onset of this failure has been challenging. An acoustic emission methodology was recently developed by the authors to detect the onset of pad cratering. The instantaneous release of elastic energy associated with the initiation of an internal crack, i.e., Acoustic Emission (AE), can be monitored to accurately determine the onset of both pad cratering and brittle intermetallic (IMC) failures.

First published in the 2012 IPC APEX EXPO technical conference proceedings.

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The new the 'buying' cycle... Buyers almost ALWAYS do a search to compare and contrast features and/or prices when making a major purchase decision.

Furthermore, we recently reviewed that searcher is almost guaranteed to NOT go past the first 2 pages of search engine results (95% of searchers do not go past the 2nd page of search engine results, or top 20 - Source: Nielsen Net Rankings).

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Increasing your web site popularity through increasing the amount of important inbound links is an imperative, especially for Google. SMTnet can help your company with the creation of these important inbound links by linking from your product catalog to your website. Read more....

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