With today's consumer technologies driving the need for denser and more compact devices, the assembly process for surface mounted devices has becoming increasingly more difficult. With the mixture of components requiring a broader range of print deposition volume, various techniques are in use in an attempt to ensure consistent and appropriate paste volume is achieved.
Some of these techniques include step etching a stencil locally on a targeted device, promoting electroformed smooth wall nickel stencils, through to laser cutting newer grade stencil materials.
This paper focuses on the relevant attributes that affect the properties of solder paste release and introduces the effects of surface free energy with respect to key elements that make up the stencil printing process.
First published in the 2012 IPC APEX EXPO technical conference proceedings.
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