Tin-rich solders are widely applied in the electronic industry in the majority of modern printed circuit boards (PCBs). Because the use of lead-tin solders has been banned in the European Union since 2006, the problem of the bridging of adjacent conductors due to tin whisker growth (limited before by the addition of Pb) has been reborn.
In this study tin alloys soldered on glass-epoxy laminate (typically used for PCBs) are considered. Scanning ion microscopy with Focused Ion Beam (FIB) system and energy-dispersive X-ray spectroscopy (EDXS) were used to determine correlations between spatial non-uniformities of the glass-epoxy laminate, the distribution of intermetallic compounds and whisker growth.
Workshops and a technical conference in addition to exhibits from electronics assembly equipment manufacturers, assembly services and design companies.
A guide to best practices on PCB cleaning, failure mechanisms, solder paste challenges, surface analytics, PCB test techniques, and low cost solutions.
SMTA - Surface Mount Technology Association is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies. Membership Info | SMTA Certification | Bookstore
IPC - Association Connecting Electronics Industries is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly. Membership Info | Training & Certification Programs | Standards & Publications - Online Store