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SMTnet Express, December 16, 2021, Subscribers: 26,148, Companies: 11,476, Users: 26,983

Technical Library

Assembly and Rework of Lead Free Package on Package Technology

Miniaturization continues to be a driving force in both integrated circuit packaging and printed circuit board laminate technology. In addition to decreasing component pitch (lead to lead spacing), utilization of the vertical space by stacking packages ...

Credits: TT Electronics - IMS

Package on Package (PoP) Stacking and Board Level Reliability, Results of Joint Industry Study

This paper presents the results of a joint - three way study between Amkor Technology, Panasonic Factory Solutions and Spansion in the area of package on package (PoP) board level reliability (BLR) (...) The scope of this paper is to cover the already popular ...

Credits: Amkor Technology, Inc.

The Challenges Of Package On Package (Pop) Devices During Assembly And Inspection

Ball Grid Array devices, BGAs, are widely used in a vast range of products including consumer, telecommunications and office based systems. As an area array device of solder joints, it provides high packing density with a relatively easy introduction cycle. However, over the last couple of years ...

Credits: Electronic Presentation Services

Package-on-Package (PoP) for Advanced PCB Manufacturing Process

In the 1990's, both BGA (Ball Grid Array) and CSP (Chip Size Package) are entering their end in the front-end packaging materials and process technology. Both BGA and CSP like SMD (Surface Mount Device) from the I 980's and THD (Through-Hole mount Device) from the 1970's are reaching its own impasse in terms of maximizing ...

Credits: Samsung Electro-Mechanics

Package-on-Package (PoP) Warpage Characteristic and Requirement

Package-on-Package (PoP) technology is widely used in mobile devices due to its simple design, lower cost and faster time to market. Warpage characteristic and requirement of PoP package becomes critical to ensure both the top and bottom package can be mounted with minimal yield lost. With this challenge in placed, iNEMI ...

Credits: Intel Corporation

Reliability Evaluation of One-Pass and Two-Pass Techniques of Assembly for Package on Packages under Torsion Loads

Package on Packages (PoP) find use in applications that require high performance with increased memory density. One of the greatest benefits of PoP technology is the elimination of the expensive and challenging task of routing high-speed memory lines from under the processor chip out to memory chip in separate packages. Instead, the memory sits ...

Credits: CALCE Center for Advanced Life Cycle Engineering

Forum search results for related keywords: package on package : 2828

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Electronics Forum

Wire Insulation Missing On A Coil Inductor --

Views: 1299

Solder Coverage in Non ROHS Paste -- We have a Philips CSM Comet II machine, now its hard disk is not getting detected and we tried to recover the data from that disk but we were unable to get the data. So, we are looking for software/data for the Philips Comet II machine. Please guide us on how and where we can get the software data or if anyone can help us to provide it for the same machine? Let us know in case any other information is required. Thanks in advance.

Views: 3895

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SMT, PCB Electronics Assembly Manufacturing News

KIC Promotes Robert Baxter to Customer Success Manager

KIC is pleased to announce the promotion of Robert Baxter to Customer Success Manager. Baxter has been with KIC for 24 years and has been the company's service manager for more than 20 years.... | KIC Thermal

KIC promotes Robert Baxter

EMS Leadership Summit at IPC APEX EXPO 2022 Brings Together Current and Future Industry Leaders

Summit to focus on driving business growth and financial success... | IPC

IPC issued reports

PDR Rework Systems Announces UL (Underwriters Laboratories) Certification Program

PDR is pleased to announce that the UL Mark for Safety is now available on all PDR Rework Systems as designated under UL UL61010-1; Electrical Equipment for Measurement, Control and Laboratory use.... | PDR-America

PDR Rework Systems have UL safety mark

Read all the NEWS...

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Events Calendar


Pan Pacific Microelectronics Symposium | January 31 - 3 | SMTA

Dallas Expo & Tech Forum | March 22 | SMTA


ZESTRON Analytical & Support Services

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Training Courses



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Online Training

Online IPC Training & Certification - Now open for limited in-person training

 EPTAC - Your 2021 IPC Training Schedule


Fundamentals of Selective Soldering Course
Dec 17, 2021 | Pennsylvania, Philadelphia | ACI Technologies, Inc.

IDEA-STD-1010 Essentials For Counterfeit Component Identification Online Live
Dec 19, 2021 | California, San Diego | EPTAC Corporation

Counterfeit Components Workshop Online Live Training
Jan 21, 2021 | New Hampshire, Manchester | EPTAC Corporation

Hand Solder Rev 8 Certification Course
Mar. 14 - Mar. 18, 2022 | New York, Rochester | EPTAC Corporation

Component Identification Online Live Certification
Mar 25, 2021 | New Hampshire, Manchester | EPTAC Corporation

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Milwaukee, WI | Cree Lighting

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Industry Associations Events


SMTA - Surface Mount Technology Association is a non-profit international association of companies and individuals (totalling 4,000) involved in all aspects of advanced electronics assembly, surface mount and related technologies.

Membership Info | SMTA Certification | Bookstore | Upcoming Events


IPC - Association Connecting Electronics Industries is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly.

Membership Info | Training & Certification | Online Store | Upcoming Events

Editor - Dave "davef" Fish (submit your technical articles), 98 Elm Street, Portland, Maine 04101 USA, Tel.207-780-0887.

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