Traditional single level microvia structures are generally considered the most robust type of interconnection within a printed wire board (PWB) substrate. The rapid implementation of HDI technology now commonly requires between 2, 3 or 4 levels of microvias sequentially processed into the product. Recent OEM funded reliability testing has confirmed that by increasing the levels (stack height) these structures are proving less reliable, when compared to their single or double level counterparts. Recently false positive results have been recorded on products tested with traditional thermal shock testing methodology (cycling between -40°C and 125°C, or 145°C). A number of companies are incurring product failures resulting in increased costs associated with replacing the circuit boards, components and added labour.
The Printed Circuit Board industry has seen a steady reduction in pitch from 1.0mm to 0.4mm; a segment of the industry is even using or considering a 0.25mm pitch. This has increased the use of stacked microvias in these designs. The process of stacking microvias has been practiced for several years in handheld devices; however, the devices generally do not operate in harsh conditions. Type 1 and Type 2 microvias have been tested over the years and have been found to be very reliable. We do not have enough test data for 3 and 4 stack microvias when placed on and off buried via. The main objective of this study was to understand the reliability of 3 and 4 stack microvias placed on and off a buried via.
Advances in miniaturized electronic devices have led to the evolution of microvias in high density interconnect (HDI) circuit boards from single-level to stacked structures that intersect multiple HDI layers. Stacked microvias are usually filled with electroplated copper. Challenges for fabricating reliable microvias include creating strong interface between the base of the microvia and the target pad, and generating no voids in the electrodeposited copper structures. Interface delamination is the most common microvia failure due to inferior quality of electroless copper, while microvia fatigue life can be reduced by over 90% as a result of large voids, according to the authors' finite element analysis and fatigue life prediction. This paper addresses the influence of voids on reliability of microvias, as well as the interface delamination issue.
High Density Interconnect (HDI) technology is fast becoming the enabling technology for the next generation of small portable electronic communication devices. These methods employ many different dielectrics and via fabrication technologies. In this research, the effect of the proximity of microvias to Plated Through Holes (PTHs) and its effect on the reliability of the microvias was extensively evaluated. The reliability of microvia interconnect structures was evaluated using Liquid-To-Liquid Thermal Shock (LLTS) testing (-55oC to +125oC). Comprehensive failure analysis was performed on microvias fabricated using different via fabrication technologies.
Router bit for cutting aluminum PCB -- We been using the Sayaka SAM-CT23Q machine to depanel PCB, it was fine. But now, we have to depanel the Aluminum PCBs the current bits from IMPEC we are using are not strong enough (1.5x8.0 diamond downcut). Need to find much strong bit or bits designs for cutting aluminum material. Any helpful tips would be apricated.
Business for sale -- Printed circuit board assembly business in private business park for sale. An entire shop including surface mount pick and place machines, reflow oven, stencil printer, wave solder machine, in line washer, work stations with solder stations, hand tools, magnifying lights, IC, Radial, and axial prep machines, complete office with desks, file cabinets, conference table and chairs, kitchen equipment includes range, sink, refrigerator and microwave. Facility includes two rest rooms. Excellent opportunity for a start-up. Call:503-332-4726 or email:shermantechnicalindustriesATgmail.com
ZESTRON is pleased to announce that it will host a webinar titled "Surface Cleanliness Assessment" on Tuesday, July 26th, from 11:00 AM to 12:00 PM EDT. This is the fifth installment of the ZESTRON Academy 2022 Cleaning Webinar Series and will be presented by our industry expert, Naveen Ravindran, M.S.Ch.E, M.S.Ch.E, Application Engineer....
Nordson TEST & INSPECTION, a division of the Nordson Corporation (Nasdaq: NDSN), is pleased to announce that Innovative Circuits Arizona (ICA) has purchased an Assure™ Pro intelligent X-ray component counter. The company recently installed the system at its facility in Gilbert, AZ....
Summary of Qualifications:
Reads instructions, such as work orders, drawing, and wire lists to determine materials needed and sequence of assembly, Manual Hand tool using for Wire cutting, stripping, crimping. Soldering, Splicing, Assembling PCB Boards, Boot Shrinking, Heat Shrink coating, Potting,5S Trained]
Summary of Qualifications:
I had 4 years experience 3 years in SMT Field and 1 year in Stock Market I have well experience in SMT process and machine Knowledge personally I have well knowledge on reflow, SPI,DEK AOI I can handle the process related issues and tackle the situation
IPC is a US-based trade association dedicated to the competitive excellence and financial success of its nearly 2,600 member companies which represent all facets of the electronic interconnection industry, including design, printed wiring board manufacturing and electronics assembly.