New Equipment | Soldering Robots
Model: DH-800 Robot Automatic Dispenser product model： DH-800D Dispensing range： 300/300/90 maximum load Y/Z: 10KG/6KG Speed X& Y/Z(mm/sec) 500/500/300 external dimensions ： 465*495*697mm Body weight（KG): 42 capacity of decomposition ：0.01m
ASCEN-PCB multi cutter separator applies to automatic online separate the PCB board. At the same time, the minimum cutting length can achieve 100mm and no limits of the cutting length. High efficiency multi cutter PCB depeneling machine's minimu
Electronics Forum | Fri Dec 16 14:01:33 EST 2005 | Thong Chai Jaidee
will use the finger cot in process keep contamnant from PCB?
Electronics Forum | Thu Jun 01 04:01:33 EDT 2006 | ts
The PT200 at line converter able to optimize your program to balance the line.
Used SMT Equipment | Pick and Place/Feeders
This item is included in the August 21-24 Online Auction. Please visit the following website for all of the details. http://bajabid.hibid.com/catalog/108607/august-2017-online-auction/?cpage=3
Used SMT Equipment | Pick and Place/Feeders
Assembleon , Type : MG-5 Yom :2010 machines less user form USA , great working condition
Industry News | 2005-03-15 01:33:40.0
Siborg Systems Inc starts marketing of a revolutionary new RCL meter
Industry News | 2009-09-17 15:01:33.0
PLEASANT PRAIRIE, WI — September 15, 2009 — PROMATION Inc. announces that a new revamped company brochure will be available at the IPC MIDWEST Conference and Exhibition to be held at the Renaissance Hotel and Convention Center Exploration and Discovery Halls in Schaumburg, IL from September 23-24, 2009.
Parts & Supplies | SMT Equipment
Part Name：TAPE HOLDER ASM (CTF) Part No：E1310706CA0
Parts & Supplies | SMT Equipment
DEK spray alcohol solenoid valve USC SOLVENT SOLENOID VALVE LOOM BOM (TXT) Part NO.: 146111
Technical Library | 2021-12-16 01:33:11.0
Ball Grid Array devices, BGAs, are widely used in a vast range of products including consumer, telecommunications and office based systems. As an area array device of solder joints, it provides high packing density with a relatively easy introduction cycle. However, over the last couple of years engineers have started to experiment, and in some cases implement, stacked packages, of the type often called Package on Package, or POP. In simple terms, POP devices are the stacking of components, one on top of the other, either during the original component manufacture or during printed board assembly.
KD Electronics Ltd. | http://www.kundasmt.com/a/PRODUCTS/3455.html
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ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/pt-BR/divisions/polymer-processing-systems/location-map-pps/europe/france
granulação: Patrick Hautson Tel.: +33 631 638 647 Fax: +49 7132 999 35 99 patrick.hautson@nordson.com O.C. Team Mr. Olivier Crave 72 La Ruaz 01 1050 Vaux-en-Bugey França Celular
